| 12016127 |
Liquid metal infiltration rework of electronic assembly |
Timothy P. Younger |
2024-06-18 |
$16,708,000 |
| 11805603 |
Applying a solderable surface to conductive ink |
Prabjit Singh |
2023-10-31 |
$8,788,000 |
| 11784424 |
Reliability enhancement of press fit connectors |
Theron Lee Lewis |
2023-10-10 |
$6,086,000 |
| 11774190 |
Pierced thermal interface constructions |
— |
2023-10-03 |
$6,984,000 |
| 11751369 |
Liquid metal infiltration rework of electronic assembly |
Timothy P. Younger |
2023-09-05 |
$6,576,000 |
| 11703922 |
Thermal interface material structures for directing heat in a three-dimensional space |
Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann |
2023-07-18 |
$11,372,000 |
| 11664302 |
Integrated circuit module with a structurally balanced package using a bottom side interposer |
— |
2023-05-30 |
$4,328,000 |
| 11456548 |
Reliability enhancement of press fit connectors |
Theron Lee Lewis |
2022-09-27 |
$6,862,000 |
| 11416045 |
Thermal interface material structures for directing heat in a three-dimensional space |
Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann |
2022-08-16 |
$11,009,000 |
| 11404287 |
Fixture facilitating heat sink fabrication |
Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more |
2022-08-02 |
$9,617,000 |
| 11310950 |
Liquid metal infiltration rework of electronic assembly |
Timothy P. Younger |
2022-04-19 |
$6,872,000 |
| 11289836 |
Land grid array electrical contact coating |
Kevin M. O'Connell, Matthew S. Doyle |
2022-03-29 |
$6,469,000 |
| 11278977 |
Liquid metal infiltration rework of electronic assembly |
Timothy P. Younger |
2022-03-22 |
$5,808,000 |
| 11228124 |
Connecting a component to a substrate by adhesion to an oxidized solder surface |
Steven P. Ostrander, Thomas Weiss, Thomas E. Lombardi |
2022-01-18 |
$5,274,000 |
| 11198807 |
Thermal interface materials with radiative coupling heat transfer |
Anil Yuksel |
2021-12-14 |
$4,192,000 |
| 11195789 |
Integrated circuit module with a structurally balanced package using a bottom side interposer |
— |
2021-12-07 |
$3,115,000 |
| 11122682 |
Tamper-respondent sensors with liquid crystal polymer layers |
James A. Busby, John R. Dangler, William L. Brodsky, William Santiago-Fernandez, David C. Long +3 more |
2021-09-14 |
$2,674,000 |
| 11037860 |
Multi layer thermal interface material |
Eric J. Campbell, Phillip V. Mann, Sarah K. Czaplewski-Campbell |
2021-06-15 |
$4,393,000 |
| 11013147 |
Thermal interface material structures |
Phillip V. Mann |
2021-05-18 |
$4,116,000 |
| 10993324 |
Computer system with modified module socket |
Charles L. Arvin, Kevin Drummond, Chris Muzzy |
2021-04-27 |
$8,613,000 |
| 10978313 |
Fixture facilitating heat sink fabrication |
Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more |
2021-04-13 |
$3,936,000 |
| 10834811 |
Implementing reworkable strain relief packaging structure for electronic component interconnects |
— |
2020-11-10 |
$848,000 |
| 10804629 |
Beveling staggered card edges |
Sandra J. Shirk/Heath, Paul W. Schaefer |
2020-10-13 |
$4,674,000 |
| 10779391 |
Integrated circuit device assembly |
David Barron, Matthew T. Richardson, Christopher W. Mann, Roger Duane Hamilton, Jason R. Eagle |
2020-09-15 |
$3,481,000 |
| 10756009 |
Efficient placement of grid array components |
Brian S. Beaman, Yuet-Ying Yu, Theron Lee Lewis |
2020-08-25 |
$2,454,000 |
