Issued Patents All Time
Showing 25 most recent of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12016127 | Liquid metal infiltration rework of electronic assembly | Timothy P. Younger | 2024-06-18 |
| 11805603 | Applying a solderable surface to conductive ink | Prabjit Singh | 2023-10-31 |
| 11784424 | Reliability enhancement of press fit connectors | Theron Lee Lewis | 2023-10-10 |
| 11774190 | Pierced thermal interface constructions | — | 2023-10-03 |
| 11751369 | Liquid metal infiltration rework of electronic assembly | Timothy P. Younger | 2023-09-05 |
| 11703922 | Thermal interface material structures for directing heat in a three-dimensional space | Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann | 2023-07-18 |
| 11664302 | Integrated circuit module with a structurally balanced package using a bottom side interposer | — | 2023-05-30 |
| 11456548 | Reliability enhancement of press fit connectors | Theron Lee Lewis | 2022-09-27 |
| 11416045 | Thermal interface material structures for directing heat in a three-dimensional space | Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann | 2022-08-16 |
| 11404287 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more | 2022-08-02 |
| 11310950 | Liquid metal infiltration rework of electronic assembly | Timothy P. Younger | 2022-04-19 |
| 11289836 | Land grid array electrical contact coating | Kevin M. O'Connell, Matthew S. Doyle | 2022-03-29 |
| 11278977 | Liquid metal infiltration rework of electronic assembly | Timothy P. Younger | 2022-03-22 |
| 11228124 | Connecting a component to a substrate by adhesion to an oxidized solder surface | Steven P. Ostrander, Thomas Weiss, Thomas E. Lombardi | 2022-01-18 |
| 11198807 | Thermal interface materials with radiative coupling heat transfer | Anil Yuksel | 2021-12-14 |
| 11195789 | Integrated circuit module with a structurally balanced package using a bottom side interposer | — | 2021-12-07 |
| 11122682 | Tamper-respondent sensors with liquid crystal polymer layers | James A. Busby, John R. Dangler, William L. Brodsky, William Santiago-Fernandez, David C. Long +3 more | 2021-09-14 |
| 11037860 | Multi layer thermal interface material | Eric J. Campbell, Phillip V. Mann, Sarah K. Czaplewski-Campbell | 2021-06-15 |
| 11013147 | Thermal interface material structures | Phillip V. Mann | 2021-05-18 |
| 10993324 | Computer system with modified module socket | Charles L. Arvin, Kevin Drummond, Chris Muzzy | 2021-04-27 |
| 10978313 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle +3 more | 2021-04-13 |
| 10834811 | Implementing reworkable strain relief packaging structure for electronic component interconnects | — | 2020-11-10 |
| 10804629 | Beveling staggered card edges | Sandra J. Shirk/Heath, Paul W. Schaefer | 2020-10-13 |
| 10779391 | Integrated circuit device assembly | David Barron, Matthew T. Richardson, Christopher W. Mann, Roger Duane Hamilton, Jason R. Eagle | 2020-09-15 |
| 10756009 | Efficient placement of grid array components | Brian S. Beaman, Yuet-Ying Yu, Theron Lee Lewis | 2020-08-25 |