Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12253354 | Radio frequency identification based three-dimensional metrology | Olawunmi Akinlemibola, Jennifer I. Bennett | 2025-03-18 |
| 12256494 | Modified internal clearance(s) at connector pin aperture(s) of a circuit board | James D. Bielick, David J. Braun, John R. Dangler, Timothy P. Younger, Stephen M. Hugo +1 more | 2025-03-18 |
| 12100910 | Shape-memory alloy lock for connectors | David J. Braun, James D. Bielick, John R. Dangler, Timothy P. Younger, Timothy J. Jennings +2 more | 2024-09-24 |
| 11906574 | Hybrid socket warp indicator | Stephen M. Hugo, Timothy J. Jennings, Timothy P. Younger, David J. Braun, Jennifer I. Bennett +2 more | 2024-02-20 |
| 11784424 | Reliability enhancement of press fit connectors | Mark K. Hoffmeyer | 2023-10-10 |
| 11742602 | Press-fit rework method | John R. Dangler, David J. Braun | 2023-08-29 |
| 11733154 | Thermal interface material detection through compression | John R. Dangler, David J. Braun | 2023-08-22 |
| 11699884 | Electromagnetic shielding of heatsinks with spring press-fit pins | David J. Braun, John R. Dangler, Timothy P. Younger, James D. Bielick, Stephen M. Hugo +2 more | 2023-07-11 |
| 11647591 | Compliant pin surface mount technology pad for rework | David J. Braun, John R. Dangler | 2023-05-09 |
| 11641717 | Soldering of end chip components in series | John R. Dangler, David J. Braun, Eric Nguyen Phan | 2023-05-02 |
| 11555793 | Anti-vibration fixturing system for nondestructive testing | David J. Braun, John R. Dangler | 2023-01-17 |
| 11456548 | Reliability enhancement of press fit connectors | Mark K. Hoffmeyer | 2022-09-27 |
| 11445650 | Localized rework using liquid media soldering | Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more | 2022-09-13 |
| 11424562 | Press-fit insertion method | John R. Dangler, David J. Braun | 2022-08-23 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, James D. Bielick, David J. Braun, Timothy P. Younger, Stephen M. Hugo +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Timothy P. Younger, James D. Bielick, Jennifer I. Bennett, David J. Braun, Tim Bartsch +2 more | 2022-02-08 |
| 11211760 | Stutter step press-fit connector insertion process | Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more | 2021-12-28 |
| 11175100 | Heat sinks using memory shaping materials | David J. Braun, Jennifer I. Bennett, James D. Bielick, John R. Dangler, Timothy P. Younger +2 more | 2021-11-16 |
| 11166401 | Dye and pry process for surface mount technology dual in-line memory module | David J. Braun | 2021-11-02 |
| 10834839 | Barrier for hybrid socket movement reduction | Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more | 2020-11-10 |
| 10756009 | Efficient placement of grid array components | Mark K. Hoffmeyer, Brian S. Beaman, Yuet-Ying Yu | 2020-08-25 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-06-09 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-03-17 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Timothy P. Younger, David J. Braun, James D. Bielick, Jennifer I. Bennett, Stephen M. Hugo +1 more | 2020-02-25 |
| 10262907 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2019-04-16 |