| 12389547 |
Hybrid mechanical drill |
Sarah K. Czaplewski-Campbell, Eric J. Campbell, Steven Chandler Borrillo |
2025-08-12 |
| 12253354 |
Radio frequency identification based three-dimensional metrology |
Olawunmi Akinlemibola, Theron Lee Lewis |
2025-03-18 |
| 12189763 |
Securing digital data by automatic mechanism incapacitating data storage device |
Jeremy Miner, Carolina Garcia Delgado, William J. Green |
2025-01-07 |
| 12100910 |
Shape-memory alloy lock for connectors |
Theron Lee Lewis, David J. Braun, James D. Bielick, John R. Dangler, Timothy P. Younger +2 more |
2024-09-24 |
| 11906574 |
Hybrid socket warp indicator |
Stephen M. Hugo, Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun +2 more |
2024-02-20 |
| 11699884 |
Electromagnetic shielding of heatsinks with spring press-fit pins |
David J. Braun, John R. Dangler, Timothy P. Younger, James D. Bielick, Stephen M. Hugo +2 more |
2023-07-11 |
| 11617519 |
Needle electrode for position-dependent injection |
Sarah K. Czaplewski-Campbell, Eric J. Campbell, Elin F. LaBreck, Christopher W. Steffen |
2023-04-04 |
| 11558964 |
Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention |
Steven Chandler Borrillo, Sarah K. Czaplewski-Campbell, Eric J. Campbell |
2023-01-17 |
| 11517072 |
Adaptive electrostatic discharge and electric hazard footwear |
Steven Chandler Borrillo, Eric J. Campbell, Sarah K. Czaplewski-Campbell |
2022-12-06 |
| 11445650 |
Localized rework using liquid media soldering |
Theron Lee Lewis, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more |
2022-09-13 |
| 11268809 |
Detecting and correcting deficiencies in surface conditions for bonding applications |
James D. Bielick, David J. Braun, Timothy P. Younger, Theron Lee Lewis, Stephen M. Hugo +2 more |
2022-03-08 |
| 11245238 |
Tool for shaping contact tab interconnects at a circuit card edge |
Timothy P. Younger, Theron Lee Lewis, James D. Bielick, David J. Braun, Tim Bartsch +2 more |
2022-02-08 |
| 11211760 |
Stutter step press-fit connector insertion process |
Timothy J. Jennings, Theron Lee Lewis, Timothy P. Younger, David J. Braun, John R. Dangler +2 more |
2021-12-28 |
| 11175100 |
Heat sinks using memory shaping materials |
Theron Lee Lewis, David J. Braun, James D. Bielick, John R. Dangler, Timothy P. Younger +2 more |
2021-11-16 |
| 10957623 |
Thermal interface material structures including protruding surface features to reduce thermal interface material migration |
Eric J. Campbell, Sarah K. Czaplewski-Campbell, Elin F. LaBreck |
2021-03-23 |
| 10881007 |
Recondition process for BGA using flux |
Tim Bartsch, James D. Bielick, David J. Braun, Timothy P. Younger |
2020-12-29 |
| 10834839 |
Barrier for hybrid socket movement reduction |
Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler +2 more |
2020-11-10 |
| 10677856 |
Facilitating reliable circuit board press-fit connector assembly fabrication |
Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler +2 more |
2020-06-09 |
| 10678316 |
Reducing thermal cycling fatigue |
Eric J. Campbell, Sarah K. Czaplewski-Campbell |
2020-06-09 |
| 10667433 |
Implementing contained thermal interface material for pluggable applications |
Eric J. Campbell, Sarah K. Czaplewski-Campbell, Elin F. LaBreck |
2020-05-26 |
| 10593601 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components |
Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more |
2020-03-17 |
| 10575448 |
Electromagnetic shielding of heat sinks with shape-memory alloy grounding |
Theron Lee Lewis, Timothy P. Younger, David J. Braun, James D. Bielick, Stephen M. Hugo +1 more |
2020-02-25 |
| 10575393 |
Heat-shielding microcapsules for protecting temperature sensitive components |
Eric J. Campbell, Sarah K. Czaplewski-Campbell, Elin F. LaBreck |
2020-02-25 |
| 10372182 |
Reducing thermal cycling fatigue |
Eric J. Campbell, Sarah K. Czaplewski-Campbell |
2019-08-06 |
| 10262907 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components |
Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more |
2019-04-16 |
