| 12256494 |
Modified internal clearance(s) at connector pin aperture(s) of a circuit board |
James D. Bielick, Theron Lee Lewis, David J. Braun, John R. Dangler, Stephen M. Hugo +1 more |
2025-03-18 |
| 12100910 |
Shape-memory alloy lock for connectors |
Theron Lee Lewis, David J. Braun, James D. Bielick, John R. Dangler, Timothy J. Jennings +2 more |
2024-09-24 |
| 12016127 |
Liquid metal infiltration rework of electronic assembly |
Mark K. Hoffmeyer |
2024-06-18 |
| 11906574 |
Hybrid socket warp indicator |
Stephen M. Hugo, Theron Lee Lewis, Timothy J. Jennings, David J. Braun, Jennifer I. Bennett +2 more |
2024-02-20 |
| 11751369 |
Liquid metal infiltration rework of electronic assembly |
Mark K. Hoffmeyer |
2023-09-05 |
| 11699884 |
Electromagnetic shielding of heatsinks with spring press-fit pins |
David J. Braun, John R. Dangler, James D. Bielick, Stephen M. Hugo, Theron Lee Lewis +2 more |
2023-07-11 |
| 11445650 |
Localized rework using liquid media soldering |
Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more |
2022-09-13 |
| 11310950 |
Liquid metal infiltration rework of electronic assembly |
Mark K. Hoffmeyer |
2022-04-19 |
| 11278977 |
Liquid metal infiltration rework of electronic assembly |
Mark K. Hoffmeyer |
2022-03-22 |
| 11268809 |
Detecting and correcting deficiencies in surface conditions for bonding applications |
Jennifer I. Bennett, James D. Bielick, David J. Braun, Theron Lee Lewis, Stephen M. Hugo +2 more |
2022-03-08 |
| 11245238 |
Tool for shaping contact tab interconnects at a circuit card edge |
Theron Lee Lewis, James D. Bielick, Jennifer I. Bennett, David J. Braun, Tim Bartsch +2 more |
2022-02-08 |
| 11211760 |
Stutter step press-fit connector insertion process |
Timothy J. Jennings, Theron Lee Lewis, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more |
2021-12-28 |
| 11175100 |
Heat sinks using memory shaping materials |
Theron Lee Lewis, David J. Braun, Jennifer I. Bennett, James D. Bielick, John R. Dangler +2 more |
2021-11-16 |
| 10881007 |
Recondition process for BGA using flux |
Tim Bartsch, James D. Bielick, David J. Braun, Jennifer I. Bennett |
2020-12-29 |
| 10834839 |
Barrier for hybrid socket movement reduction |
Theron Lee Lewis, Timothy J. Jennings, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more |
2020-11-10 |
| 10677856 |
Facilitating reliable circuit board press-fit connector assembly fabrication |
Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler +2 more |
2020-06-09 |
| 10593601 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components |
Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more |
2020-03-17 |
| 10575448 |
Electromagnetic shielding of heat sinks with shape-memory alloy grounding |
Theron Lee Lewis, David J. Braun, James D. Bielick, Jennifer I. Bennett, Stephen M. Hugo +1 more |
2020-02-25 |
| 10262907 |
Dye and pry process for removing quad flat no-lead packages and bottom termination components |
Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more |
2019-04-16 |
| 9537234 |
Method of making a solder tail extender connector |
William L. Brodsky, John R. Dangler, Mark K. Hoffmeyer |
2017-01-03 |
