Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256494 | Modified internal clearance(s) at connector pin aperture(s) of a circuit board | James D. Bielick, Theron Lee Lewis, David J. Braun, John R. Dangler, Stephen M. Hugo +1 more | 2025-03-18 |
| 12100910 | Shape-memory alloy lock for connectors | Theron Lee Lewis, David J. Braun, James D. Bielick, John R. Dangler, Timothy J. Jennings +2 more | 2024-09-24 |
| 12016127 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2024-06-18 |
| 11906574 | Hybrid socket warp indicator | Stephen M. Hugo, Theron Lee Lewis, Timothy J. Jennings, David J. Braun, Jennifer I. Bennett +2 more | 2024-02-20 |
| 11751369 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2023-09-05 |
| 11699884 | Electromagnetic shielding of heatsinks with spring press-fit pins | David J. Braun, John R. Dangler, James D. Bielick, Stephen M. Hugo, Theron Lee Lewis +2 more | 2023-07-11 |
| 11445650 | Localized rework using liquid media soldering | Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2022-09-13 |
| 11310950 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2022-04-19 |
| 11278977 | Liquid metal infiltration rework of electronic assembly | Mark K. Hoffmeyer | 2022-03-22 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, James D. Bielick, David J. Braun, Theron Lee Lewis, Stephen M. Hugo +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Theron Lee Lewis, James D. Bielick, Jennifer I. Bennett, David J. Braun, Tim Bartsch +2 more | 2022-02-08 |
| 11211760 | Stutter step press-fit connector insertion process | Timothy J. Jennings, Theron Lee Lewis, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more | 2021-12-28 |
| 11175100 | Heat sinks using memory shaping materials | Theron Lee Lewis, David J. Braun, Jennifer I. Bennett, James D. Bielick, John R. Dangler +2 more | 2021-11-16 |
| 10881007 | Recondition process for BGA using flux | Tim Bartsch, James D. Bielick, David J. Braun, Jennifer I. Bennett | 2020-12-29 |
| 10834839 | Barrier for hybrid socket movement reduction | Theron Lee Lewis, Timothy J. Jennings, David J. Braun, John R. Dangler, Jennifer I. Bennett +2 more | 2020-11-10 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-06-09 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-03-17 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Theron Lee Lewis, David J. Braun, James D. Bielick, Jennifer I. Bennett, Stephen M. Hugo +1 more | 2020-02-25 |
| 10262907 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2019-04-16 |
| 9537234 | Method of making a solder tail extender connector | William L. Brodsky, John R. Dangler, Mark K. Hoffmeyer | 2017-01-03 |