Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256494 | Modified internal clearance(s) at connector pin aperture(s) of a circuit board | Theron Lee Lewis, David J. Braun, John R. Dangler, Timothy P. Younger, Stephen M. Hugo +1 more | 2025-03-18 |
| 12100910 | Shape-memory alloy lock for connectors | Theron Lee Lewis, David J. Braun, John R. Dangler, Timothy P. Younger, Timothy J. Jennings +2 more | 2024-09-24 |
| 11906574 | Hybrid socket warp indicator | Stephen M. Hugo, Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun +2 more | 2024-02-20 |
| 11699884 | Electromagnetic shielding of heatsinks with spring press-fit pins | David J. Braun, John R. Dangler, Timothy P. Younger, Stephen M. Hugo, Theron Lee Lewis +2 more | 2023-07-11 |
| 11445650 | Localized rework using liquid media soldering | Theron Lee Lewis, Jennifer I. Bennett, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more | 2022-09-13 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, David J. Braun, Timothy P. Younger, Theron Lee Lewis, Stephen M. Hugo +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Timothy P. Younger, Theron Lee Lewis, Jennifer I. Bennett, David J. Braun, Tim Bartsch +2 more | 2022-02-08 |
| 11211760 | Stutter step press-fit connector insertion process | Timothy J. Jennings, Theron Lee Lewis, Timothy P. Younger, David J. Braun, John R. Dangler +2 more | 2021-12-28 |
| 11175100 | Heat sinks using memory shaping materials | Theron Lee Lewis, David J. Braun, Jennifer I. Bennett, John R. Dangler, Timothy P. Younger +2 more | 2021-11-16 |
| 10939600 | Flux residue detection | Jiayu Zheng, Weifeng Zhang, Lin Zhao, XiYuan Yin, Tao Song | 2021-03-02 |
| 10881007 | Recondition process for BGA using flux | Tim Bartsch, David J. Braun, Jennifer I. Bennett, Timothy P. Younger | 2020-12-29 |
| 10834839 | Barrier for hybrid socket movement reduction | Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler +2 more | 2020-11-10 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Stephen M. Hugo, Tim Bartsch, David J. Braun, John R. Dangler, Theron Lee Lewis +2 more | 2020-06-09 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more | 2020-03-17 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Theron Lee Lewis, Timothy P. Younger, David J. Braun, Jennifer I. Bennett, Stephen M. Hugo +1 more | 2020-02-25 |
| 10262907 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more | 2019-04-16 |
| 9578794 | Apparatus and method for detaching a component from a mounting surface | Michk Huang, Yun Ting Lee | 2017-02-21 |
| 6261404 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, Phillip Duane Isaacs, Michael L. Zumbrunnen | 2001-07-17 |
| 6084775 | Heatsink and package structures with fusible release layer | Gerald K. Bartley, Douglas A. Baska, Matthew A. Butterbaugh, Mark K. Hoffmeyer, Sukhvinder S. Kang | 2000-07-04 |
| 5905636 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, Phillip Duane Isaacs, Michael L. Zumbrunnen | 1999-05-18 |
| 5873512 | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | Mark K. Hoffmeyer, Phillip Duane Isaacs, Thomas D. Kidd, David Allen Sluzewski | 1999-02-23 |
| 5806753 | Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier | Mark K. Hoffmeyer, Phillip Duane Isaacs, Thomas D. Kidd, David Allen Sluzewski | 1998-09-15 |
| 5745344 | Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device | Douglas A. Baska, Darryl J. Becker, Phillip Duane Isaacs, Michael L. Zumbrunnen | 1998-04-28 |
| 5651493 | Method of performing solder joint analysis of semi-conductor components | Mark K. Hoffmeyer, Phillip Duane Isaacs | 1997-07-29 |