MZ

Michael L. Zumbrunnen

IBM: 12 patents #9,222 of 70,183Top 15%
JU Jds Uniphase: 4 patents #116 of 940Top 15%
📍 Poughkeepsie, NY: #225 of 1,613 inventorsTop 15%
🗺 New York: #7,917 of 115,490 inventorsTop 7%
Overall (All Time): #251,262 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
11612515 Method and apparatus of a self-managed portable hypothermia system Laura Marie Zumbrunnen 2023-03-28
10806626 Method and apparatus of a self-managed portable hypothermia system Laura Marie Zumbrunnen 2020-10-20
7211728 Optical cage system preventing insertion of incorrect module Gerald Daniel Malagrino, Jr. 2007-05-01
7178996 High density optical transceiver Gerald Daniel Malagrino, Jr. 2007-02-20
7131859 Heat dissipating cages for optical transceiver systems Leland Leslie Day 2006-11-07
7004647 Optical transceiver bail latch Gerald Daniel Malagrino, Jr. 2006-02-28
6540414 Integrated optical coupler and housing arrangement Johnny R. Brezina, Brian M. Kerrigan, Gerald Daniel Malagrino, Jr., James R. Moon 2003-04-01
6261404 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device Douglas A. Baska, Darryl J. Becker, James D. Bielick, Phillip Duane Isaacs 2001-07-17
5905636 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device Douglas A. Baska, Darryl J. Becker, James D. Bielick, Phillip Duane Isaacs 1999-05-18
5745344 Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device Douglas A. Baska, Darryl J. Becker, James D. Bielick, Phillip Duane Isaacs 1998-04-28
5611696 High density and high current capacity pad-to-pad connector comprising of spring connector elements (SCE) Edward O. Donner 1997-03-18
5608966 Process for manufacture of spring contact elements and assembly thereof Edward O. Donner 1997-03-11
5228502 Cooling by use of multiple parallel convective surfaces Richard C. Chu, Gary F. Goth, Gaetano P. Messina, Kevin P. Moran 1993-07-20
5170319 Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels Richard Chao-Fan Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Robert E. Simons 1992-12-08
5161089 Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same Richard C. Chu, Michael J. Ellsworth, Jr., Gary F. Goth, Robert E. Simons 1992-11-03
5016090 Cross-hatch flow distribution and applications thereof George T. Galyon, George M. Jordhamo, Kevin P. Moran 1991-05-14
5005638 Thermal conduction module with barrel shaped piston for improved heat transfer Gary F. Goth, Kevin P. Moran 1991-04-09
4765400 Circuit module with pins conducting heat from floating plate contacting heat producing device Richard C. Chu, Jeffrey Eid 1988-08-23