Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7448598 | Quick panel lifter | Patrick Elmlinger | 2008-11-11 |
| 6955543 | Method and apparatus to form a reworkable seal on an electronic module | Patrick A. Coico, Lewis S. Goldmann, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz | 2005-10-18 |
| 6778393 | Cooling device with multiple compliant elements | Lawrence S. Mok, Tsorng-Dih Yuan | 2004-08-17 |
| 6404638 | Small gaps cooling technology | — | 2002-06-11 |
| 6049456 | Electronic module adjustment design and process using shims | Armando S. Cammarano, Patrick A. Coico, Ronald L. Hering, Eric B. Hultmark, Raed A. Sherif | 2000-04-11 |
| 5891755 | Process for flat plate cooling a semiconductor chip using a thermal paste retainer | David L. Edwards, Sushumna Iruvanti, Raed A. Sherif | 1999-04-06 |
| 5825087 | Integral mesh flat plate cooling module | Sushumna Iruvanti, Martin Klepeis, Raed A. Sherif | 1998-10-20 |
| 5819402 | Method for cooling of chips using blind holes with customized depth | David L. Edwards, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-10-13 |
| 5770478 | Integral mesh flat plate cooling method | Sushumna Iruvanti, Martin Klepeis, Raed A. Sherif | 1998-06-23 |
| 5757620 | Apparatus for cooling of chips using blind holes with customized depth | David L. Edwards, Mark G. Courtney, Albert Joseph Fahey, Gregory S. Hopper, Sushumna Iruvanti +2 more | 1998-05-26 |
| 5724729 | Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper +2 more | 1998-03-10 |
| 5719443 | Adjustable spacer for flat plate cooling applications | — | 1998-02-17 |
| 5706171 | Flat plate cooling using a thermal paste retainer | David L. Edwards, Sushumna Iruvanti, Raed A. Sherif | 1998-01-06 |
| 5623394 | Apparatus for cooling of chips using a plurality of customized thermally conductive materials | Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper +2 more | 1997-04-22 |
| 5604978 | Method for cooling of chips using a plurality of materials | Raed A. Sherif, Mark G. Courtney, David L. Edwards, Albert Joseph Fahey, Gregory S. Hopper +2 more | 1997-02-25 |
| 5517753 | Adjustable spacer for flat plate cooling applications | — | 1996-05-21 |
| 5309319 | Integral cooling system for electric components | — | 1994-05-03 |
| 5294830 | Apparatus for indirect impingement cooling of integrated circuit chips | Steven P. Young, John Acocella, Albert Joseph Fahey, Seaho Song | 1994-03-15 |
| 5239200 | Apparatus for cooling integrated circuit chips | Robert A. BREWSTER, Theodore J. Kara, Seaho Song | 1993-08-24 |
| 5239443 | Blind hole cold plate cooling system | Albert Joseph Fahey, John B. Pavelka, Raed A. Sherif | 1993-08-24 |
| 5228502 | Cooling by use of multiple parallel convective surfaces | Richard C. Chu, Gary F. Goth, Kevin P. Moran, Michael L. Zumbrunnen | 1993-07-20 |