Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887924 | Chip scale package | Craig MCADAM, Jonathan Taylor, Douglas J.W. MACFARLANE, John L. Kerr, James MUNGER +1 more | 2024-01-30 |
| 11562952 | Chip scale package | Craig MCADAM, Jonathan Taylor, Douglas J.W. MACFARLANE, John L. Kerr, James MUNGER +1 more | 2023-01-24 |
| 9355870 | Integrated circuit with sensor area and resin dam | — | 2016-05-31 |
| 8852513 | Systems and methods for packaging integrated circuit gas sensor systems | Raymond J. Speer, Leon Cavanagh, Peter J. Smith | 2014-10-07 |
| 7990132 | Current sensor including an integrated circuit die including a first and second coil | Timothy J. Dupuis | 2011-08-02 |
| 7935990 | RF power amplifier and method for packaging the same | Susanne A. Paul, Timothy J. Dupuis | 2011-05-03 |
| 7679162 | Integrated current sensor package | Timothy J. Dupuis | 2010-03-16 |
| 7362086 | Integrated current sensor | Timothy J. Dupuis | 2008-04-22 |
| 7224232 | RF power amplifier and method for packaging the same | Susanne A. Paul, Timothy J. Dupuis | 2007-05-29 |
| 7209011 | Method and apparatus for synthesizing high-frequency signals for wireless communications | David R. Welland, Edmund G. Healy | 2007-04-24 |
| 6903617 | Method and apparatus for synthesizing high-frequency signals for wireless communications | Lysander Lim, David R. Welland, Edmund G. Healy | 2005-06-07 |
| 6323735 | Method and apparatus for synthesizing high-frequency signals utilizing on-package oscillator circuit inductors | David R. Welland, Edmund G. Healy | 2001-11-27 |
| 6274214 | Microelectronic package module with temporary lid | Joseph Chan, Frank L. Pompeo, Hilton T. Toy | 2001-08-14 |
| 6054008 | Process for adhesively attaching a temporary lid to a microelectronic package | Joseph Chan, Frank L. Pompeo, Hilton T. Toy | 2000-04-25 |
| D407382 | Lid for a microelectronic package | John V. Acciaioli, Myra Muth Boenke, Larry D. Gross, Martin Jay Marotti, Roland Zapfe | 1999-03-30 |
| 5870823 | Method of forming a multilayer electronic packaging substrate with integral cooling channels | Raschid J. Bezama, Jon A. Casey, Glenn A. Pomerantz | 1999-02-16 |
| 5764529 | Method and apparatus for automatic frequency and voltage selection for microprocessors | Louis Bennie Capps, Jr., Son H. Lam, An Xuan Tra | 1998-06-09 |
| 5745238 | Apparatus and method for non-destructive inspection and/or measurement | David C. Long, Karl F. Stroms, Gerhard Weiss | 1998-04-28 |
| 5239443 | Blind hole cold plate cooling system | Albert Joseph Fahey, Gaetano P. Messina, Raed A. Sherif | 1993-08-24 |