Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8466486 | Thermal management system for multiple heat source devices | — | 2013-06-18 |
| 8247900 | Flip chip package having enhanced thermal and mechanical performance | — | 2012-08-21 |
| 7514775 | Stacked structures and methods of fabricating stacked structures | Clinton Chao, Hsin-Yu Pan, Kim Chen, Mark Shane Peng, Tjandra Winata Karta | 2009-04-07 |
| 7361986 | Heat stud for stacked chip package | Hsin-Yu Pan, Chung-Yi Lin | 2008-04-22 |
| 7348218 | Semiconductor packages and methods of manufacturing thereof | Ching-Yu Ni, Hsin-Yu Pan | 2008-03-25 |
| 7329600 | Low dielectric semiconductor device and process for fabricating the same | Lawrence A. Clevenger, Louis L. Hsu, Christy S. Tyberg | 2008-02-12 |
| 7138300 | Structural design for flip-chip assembly | Hsin-Yu Pan, Chung-Yi Lin | 2006-11-21 |
| 7135769 | Semiconductor packages and methods of manufacturing thereof | Ching-Yu Ni, Hsin-Yu Pan | 2006-11-14 |
| 7134484 | Increased efficiency in liquid and gaseous planar device cooling technology | Lawrence S. Mok | 2006-11-14 |
| 7052937 | Method and structure for providing improved thermal conduction for silicon semiconductor devices | Lawrence A. Clevenger, Louis L. Hsu, Li-Kong Wang | 2006-05-30 |
| 6778393 | Cooling device with multiple compliant elements | Gaetano P. Messina, Lawrence S. Mok | 2004-08-17 |
| 6617702 | Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate | Louis L. Hsu, Rajiv V. Joshi, Carl Radens, Jack A. Mandelman | 2003-09-09 |
| 6579743 | Chip packaging system and method using deposited diamond film | Lawrence A. Clevenger, Louis L. Hsu, Li-Kong Wang | 2003-06-17 |
| 6337513 | Chip packaging system and method using deposited diamond film | Lawrence A. Clevenger, Louis L. Hsu, Li-Kong Wang | 2002-01-08 |
| 5366923 | Bonded wafer structure having a buried insulation layer | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu | 1994-11-22 |
| 5276338 | Bonded wafer structure having a buried insulation layer | Klaus D. Beyer, Chang-Ming Hsieh, Louis L. Hsu | 1994-01-04 |