Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10345887 | Adaptive optimization of low power strategies | Kuo-Su Hsiao, Yen-Lin Lee, Shih-Yen Chiu, Jia-Ming Chen, Ya-Ting Chang | 2019-07-09 |
| 10216526 | Controlling method for optimizing a processor and controlling system | Lee-Kee Yong, Yi-Chang Zhuang | 2019-02-26 |
| 10114432 | Thermal control system and thermal control method for electronic device | Lee-Kee Yong | 2018-10-30 |
| 9958895 | Bandgap reference apparatus and methods | Chih-Chia Chen | 2018-05-01 |
| 9686865 | Networking packages based on interposers | Yun-Han Lee, Shyh-An Chi | 2017-06-20 |
| 9406597 | Integrated circuit system with distributed power supply comprising interposer and voltage regulator | Shyh-An Chi, Yun-Han Lee | 2016-08-02 |
| 9177892 | Apparatus and method for increasing bandwidths of stacked dies | Shyh-An Chi | 2015-11-03 |
| 9064715 | Networking packages based on interposers | Yun-Han Lee, Shyh-An Chi | 2015-06-23 |
| 8952548 | Apparatus and method for increasing bandwidths of stacked dies | Shyh-An Chi | 2015-02-10 |
| 8945998 | Programmable semiconductor interposer for electronic package and method of forming | Chao-Shun Hsu, Clinton Chao | 2015-02-03 |
| 8716855 | Integrated circuit system with distributed power supply comprising interposer and voltage regulator module | Shyh-An Chi, Yun-Han Lee | 2014-05-06 |
| 8476735 | Programmable semiconductor interposer for electronic package and method of forming | Chao-Shun Hsu, Clinton Chao | 2013-07-02 |
| 8276110 | Reducing voltage drops in power networks using unused spaces in integrated circuits | Dinesh Baviskar, Wen-Hao Chen, Chung-Sheng Yuan, Yun-Han Lee | 2012-09-25 |
| 7989226 | Clocking architecture in stacked and bonded dice | — | 2011-08-02 |
| 7859117 | Clocking architecture in stacked and bonded dice | — | 2010-12-28 |
| 7812426 | TSV-enabled twisted pair | Clinton Chao, Chao-Shun Hsu | 2010-10-12 |
| 7795735 | Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom | Chao-Shun Hsu, Chen-Yao Tang, Clinton Chao | 2010-09-14 |
| 7565635 | SiP (system in package) design systems and methods | Clinton Chao, Louis Chaochiuan Liu, Lewis Chu, Chao-Shun Hsu, Kim Chen | 2009-07-21 |
| 7514775 | Stacked structures and methods of fabricating stacked structures | Clinton Chao, Tsorng-Dih Yuan, Hsin-Yu Pan, Kim Chen, Tjandra Winata Karta | 2009-04-07 |
| 7494846 | Design techniques for stacking identical memory dies | Chao-Shun Hsu, Louis Liu, Clinton Chao | 2009-02-24 |
| 7427803 | Electromagnetic shielding using through-silicon vias | Clinton Chao, Chao-Shun Hsu, Szu-Wei Lu, Tjandra Winata Karta | 2008-09-23 |
| 7339512 | Analog-to-digital converter without track-and-hold | Kush Gulati, Carlos Muñoz, Anurag Pulincherry | 2008-03-04 |