Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343352 | Integrated circuit using deep trench through silicon (DTS) | Kuo-Yu Cheng, Wei-Kung Tsai, Kuan-Chi Tsai, Tsung-Yu Yang, Chung-Long Chang +3 more | 2016-05-17 |
| 8941211 | Integrated circuit using deep trench through silicon (DTS) | Kuo-Yu Cheng, Wei-Kung Tsai, Kuan-Chi Tsai, Tsung-Yu Yang, Chung-Long Chang +3 more | 2015-01-27 |
| 7795735 | Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom | Chao-Shun Hsu, Clinton Chao, Mark Shane Peng | 2010-09-14 |