Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162749 | Bond wave optimization method and device | Kang-Yi Lien, I-Hsuan Chiu, Yi Huang, Chia-Ming Hung, Hsiang-Fu Chen | 2024-12-10 |
| 11834332 | Bond wave optimization method and device | Kang-Yi Lien, Yi Huang, Hsiang-Fu Chen, Chia-Ming Hung, I-Hsuan Chiu | 2023-12-05 |
| 11264378 | Integrated circuit | Shao-Yu Chen, Chih-Ping Chao, Chun-Hung Chen, Chung-Long Chang, Wei-Kung Tsai +4 more | 2022-03-01 |
| 11121098 | Trap layer substrate stacking technique to improve performance for RF devices | Kuo-Yu Cheng, Chih-Ping Chao, Shih-Shiung Chen, Wei-Kung Tsai | 2021-09-14 |
| 11121100 | Trap layer substrate stacking technique to improve performance for RF devices | Kuo-Yu Cheng, Chih-Ping Chao, Shih-Shiung Chen, Wei-Kung Tsai | 2021-09-14 |
| 10515949 | Integrated circuit and manufacturing method thereof | Shao-Yu Chen, Chih-Ping Chao, Chun-Hung Chen, Chung-Long Chang, Wei-Kung Tsai +4 more | 2019-12-24 |
| 10290576 | Stress reduction apparatus with an inverted cup-shaped layer | Ying-Ti Lu, Wen-Tsao Chen, Ming-Ray Mao | 2019-05-14 |
| 10153300 | Semiconductor device including a high-electron-mobility transistor (HEMT) and method for manufacturing the same | Jun-De Jin | 2018-12-11 |
| 10090327 | Semiconductor device and method for forming the same | Kuo-Yu Cheng, Keng-Yu Chen, Wei-Kung Tsai, Tsung-Yu Yang, Chung-Long Chang +2 more | 2018-10-02 |
| 9865534 | Stress reduction apparatus | Ying-Ti Lu, Wen-Tsao Chen, Ming-Ray Mao | 2018-01-09 |
| 9799557 | Semiconductor device structure with metal ring on silicon-on-insulator (SOI) substrate | Kuo-Yu Cheng, Wei-Kung Tsai | 2017-10-24 |
| 9761546 | Trap layer substrate stacking technique to improve performance for RF devices | Kuo-Yu Cheng, Chih-Ping Chao, Shih-Shiung Chen, Wei-Kung Tsai | 2017-09-12 |
| 9711521 | Substrate fabrication method to improve RF (radio frequency) device performance | Yong-En Syu, Kuo-Yu Cheng, Keng-Yu Chen, Shih-Shiung Chen, Shao-Yu Chen +2 more | 2017-07-18 |
| 9589831 | Mechanisms for forming radio frequency (RF) area of integrated circuit structure | Kuo-Yu Cheng, Keng-Yu Chen, Wei-Kung Tsai, Tsung-Yu Yang, Chung-Long Chang +2 more | 2017-03-07 |
| 9543152 | MIM capacitors for leakage current improvement | Ching-Hung Huang, Bo-Chang Su, Chih-Ho Tai, Wen-Tsao Chen | 2017-01-10 |
| 9373536 | Stress reduction apparatus | Ying-Ti Lu, Wen-Tsao Chen, Ming-Ray Mao | 2016-06-21 |
| 9373675 | Capacitor structure and method of forming the same | Tai-Chun Lin, Wen-Tsao Chen, Chih-Ho Tai, Ming-Ray Mao | 2016-06-21 |
| 9362222 | Interconnection between inductor and metal-insulator-metal (MIM) capacitor | Chih-Hung Hsueh, Yen-Hsiang Hsu | 2016-06-07 |
| 9343352 | Integrated circuit using deep trench through silicon (DTS) | Kuo-Yu Cheng, Wei-Kung Tsai, Tsung-Yu Yang, Chung-Long Chang, Chun-Hong Chen +3 more | 2016-05-17 |
| 9230988 | Mechanisms for forming radio frequency (RF) area of integrated circuit structure | Kuo-Yu Cheng, Keng-Yu Chen, Wei-Kung Tsai, Tsung-Yu Yang, Chung-Long Chang +2 more | 2016-01-05 |
| 9184154 | Methods for fabricating integrated passive devices on glass substrates | Wen-Chao Chen, Ming-Ray Mao, Shih-Hsien Yang | 2015-11-10 |
| 9048287 | Mechanisms for forming semiconductor device structure with floating spacer | Kuo-Yu Cheng, Wei-Kung Tsai | 2015-06-02 |
| 8941211 | Integrated circuit using deep trench through silicon (DTS) | Kuo-Yu Cheng, Wei-Kung Tsai, Tsung-Yu Yang, Chung-Long Chang, Chun-Hong Chen +3 more | 2015-01-27 |
| 8884441 | Process of ultra thick trench etch with multi-slope profile | Chih-Hung Hsueh, Wei Wang, Shao-Yu Chen, Chun-Liang Fan | 2014-11-11 |
| 8860224 | Preventing the cracking of passivation layers on ultra-thick metals | Yu-Wen Chen, Chuang-Han Hsieh, Kun-Yu Lin | 2014-10-14 |