Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8884441 | Process of ultra thick trench etch with multi-slope profile | Chih-Hung Hsueh, Wei Wang, Shao-Yu Chen, Kuan-Chi Tsai | 2014-11-11 |
| 6764810 | Method for dual-damascene formation using a via plug | Ching-Tien Ma, Tsung-Chuan Chen | 2004-07-20 |
| 6080627 | Method for forming a trench power metal-oxide semiconductor transistor | Tien-Min Yuan, Shih-Chi Lai, Yao-Chi Chang | 2000-06-27 |