Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8089153 | Method for eliminating loading effect using a via plug | Wu Xiang Hui, Man Hua Shen, Chi Yu Shan | 2012-01-03 |
| 7939915 | Contact etch stop film | Hok Min Ho, Woei Ji Song | 2011-05-10 |
| 7655554 | Method for eliminating loading effect using a via plug | Wu XiangHui, Man Hua Shen, Chi Yu Shan | 2010-02-02 |
| 7629673 | Contact etch stop film | Hok Min Ho, Woei Ji Song | 2009-12-08 |
| 6830877 | Method for forming via and contact holes with deep UV photoresist | Tsung-Chuan Chen, Shew-Tsu Hsu | 2004-12-14 |
| 6764810 | Method for dual-damascene formation using a via plug | Tsung-Chuan Chen, Chun-Liang Fan | 2004-07-20 |
| 6652666 | Wet dip method for photoresist and polymer stripping without buffer treatment step | Chen-Hsi Shih, Dian-Hau Chen, Gau-Ming Lu, Cho-Ching Chen | 2003-11-25 |
| 6583062 | Method of improving an aspect ratio while avoiding etch stop | Tsung-Chuan Chen, Shew-Tsu Hsu | 2003-06-24 |
| 6570257 | IMD film composition for dual damascene process | Dian-Hau Chen, Hsiang-Tan Lee | 2003-05-27 |
| 6316351 | Inter-metal dielectric film composition for dual damascene process | Dian-Hau Chen, Hsiang-Tan Lee | 2001-11-13 |