LC

Lewis Chu

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Pingzhen District, TW: #194 of 355 inventorsTop 55%
Overall (All Time): #3,331,158 of 4,157,543Top 85%
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Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7565635 SiP (system in package) design systems and methods Clinton Chao, Louis Chaochiuan Liu, Mark Shane Peng, Chao-Shun Hsu, Kim Chen 2009-07-21