Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050061 | Shrouded powder patch | — | 2024-07-30 |
| 11650015 | Method and apparatus for thermosiphon device | — | 2023-05-16 |
| 10989483 | Thermosiphon with multiport tube and flow arrangement | Morten Søegaard Espersen, Maria Luisa Angrisani, Marco La Foresta | 2021-04-27 |
| 10655920 | Thermosiphon with bent tube section | Morten Søegaard Espersen, Maria Luisa Angrisani, Dennis N. Jensen | 2020-05-19 |
| 10077768 | Planar coil and support for actuator of fluid mover | Timothy S. Lucas | 2018-09-18 |
| 10054371 | Thermosiphon with integrated components | Morten Søegaard Espersen, Marco Moruzzi, Dennis N. Jensen | 2018-08-21 |
| 9042100 | System and method for cooling heat generating components | — | 2015-05-26 |
| 8286693 | Heat sink base plate with heat pipe | Bradley R. Whitney | 2012-10-16 |
| 7306027 | Fluid-containing cooling plate for an electronic component | Bradley R. Whitney, Randolph H. Cook, John R. Cennamo | 2007-12-11 |
| 7176508 | Temperature sensor for high power very large scale integration circuits | Rajiv V. Joshi | 2007-02-13 |
| 6542359 | Apparatus and method for cooling a wearable computer | Raymond F. Babcock, Matthew A. Butterbaugh | 2003-04-01 |
| 6246581 | Heated PCB interconnect for cooled IC chip modules | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2001-06-12 |
| 6243268 | Cooled IC chip modules with an insulated circuit board | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2001-06-05 |
| 6233959 | Dehumidified cooling assembly for IC chip modules | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2001-05-22 |
| 6233960 | Spot cooling evaporator cooling system for integrated circuit chip modules | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2001-05-22 |
| 6122926 | Low thermal conductance insulated cooling assembly for IC chip modules | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2000-09-26 |
| 6125036 | Moisture barrier seals for cooled IC chip module assemblies | Howard Victor Mahaney, Jr., Roger R. Schmidt, Prabjit Singh | 2000-09-26 |
| 6084775 | Heatsink and package structures with fusible release layer | Gerald K. Bartley, Douglas A. Baska, James D. Bielick, Matthew A. Butterbaugh, Mark K. Hoffmeyer | 2000-07-04 |
| 6061240 | Push pin assembly for heat sink for cooling electronic modules | Matthew A. Butterbaugh, Roger Duane Hamilton | 2000-05-09 |
| 6000623 | System packaging for high performance computer applications | Kenneth George Blatti, Mark G. Clark, Todd D. Green, David G. Lund, Christopher W. Mann +1 more | 1999-12-14 |
| 5978223 | Dual heat sink assembly for cooling multiple electronic modules | Roger Duane Hamilton | 1999-11-02 |
| 5940266 | Bi-directional cooling arrangement for use with an electronic component enclosure | Roger Duane Hamilton, Christopher W. Mann | 1999-08-17 |
| 5923531 | Enhanced circuit board arrangement for a computer | Wesley H. Bachman, Douglas A. Baska, Matthew A. Butterbaugh, Kenneth E. Lubahn, Brian Scott Mullenbach +1 more | 1999-07-13 |
| 5870286 | Heat sink assembly for cooling electronic modules | Matthew A. Butterbaugh, Roger Duane Hamilton | 1999-02-09 |
| 5757998 | Multigigabit adaptable transceiver module | Raymond J. Thatcher, Mark K. Hoffmeyer, David Peter Gaio | 1998-05-26 |