Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256494 | Modified internal clearance(s) at connector pin aperture(s) of a circuit board | James D. Bielick, Theron Lee Lewis, David J. Braun, John R. Dangler, Timothy P. Younger +1 more | 2025-03-18 |
| 12100910 | Shape-memory alloy lock for connectors | Theron Lee Lewis, David J. Braun, James D. Bielick, John R. Dangler, Timothy P. Younger +2 more | 2024-09-24 |
| 11906574 | Hybrid socket warp indicator | Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, Jennifer I. Bennett +2 more | 2024-02-20 |
| 11699884 | Electromagnetic shielding of heatsinks with spring press-fit pins | David J. Braun, John R. Dangler, Timothy P. Younger, James D. Bielick, Theron Lee Lewis +2 more | 2023-07-11 |
| 11445650 | Localized rework using liquid media soldering | Theron Lee Lewis, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2022-09-13 |
| 11268809 | Detecting and correcting deficiencies in surface conditions for bonding applications | Jennifer I. Bennett, James D. Bielick, David J. Braun, Timothy P. Younger, Theron Lee Lewis +2 more | 2022-03-08 |
| 11245238 | Tool for shaping contact tab interconnects at a circuit card edge | Timothy P. Younger, Theron Lee Lewis, James D. Bielick, Jennifer I. Bennett, David J. Braun +2 more | 2022-02-08 |
| 11211760 | Stutter step press-fit connector insertion process | Timothy J. Jennings, Theron Lee Lewis, Timothy P. Younger, David J. Braun, John R. Dangler +2 more | 2021-12-28 |
| 11175100 | Heat sinks using memory shaping materials | Theron Lee Lewis, David J. Braun, Jennifer I. Bennett, James D. Bielick, John R. Dangler +2 more | 2021-11-16 |
| 10834839 | Barrier for hybrid socket movement reduction | Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler +2 more | 2020-11-10 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler, Theron Lee Lewis +2 more | 2020-06-09 |
| 10679926 | Method of making integrated die paddle structures for bottom terminated components | Mark J. Jeanson, Matthew S. Kelly | 2020-06-09 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-03-17 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Theron Lee Lewis, Timothy P. Younger, David J. Braun, James D. Bielick, Jennifer I. Bennett +1 more | 2020-02-25 |
| 10559522 | Integrated die paddle structures for bottom terminated components | Mark J. Jeanson, Matthew S. Kelly | 2020-02-11 |
| 10262907 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, Jennifer I. Bennett, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2019-04-16 |
| 10168383 | Testing printed circuit board assembly | Mark K. Hoffmeyer, Mark J. Jeanson, Matthew S. Kelly | 2019-01-01 |
| 10083894 | Integrated die paddle structures for bottom terminated components | Mark J. Jeanson, Matthew S. Kelly | 2018-09-25 |
| 10073134 | Laminate bond strength detection | Theron Lee Lewis | 2018-09-11 |
| 10048312 | Testing printed circuit board assembly | Mark K. Hoffmeyer, Mark J. Jeanson, Matthew S. Kelly | 2018-08-14 |
| 9986649 | Increasing solder hole-fill in a printed circuit board assembly | Matthew S. Kelly | 2018-05-29 |
| 9910085 | Laminate bond strength detection | Theron Lee Lewis | 2018-03-06 |
| 9733134 | Solder assembly temperature monitoring process | Matthew S. Kelly | 2017-08-15 |
| 9714870 | Solder assembly temperature monitoring process | Matthew S. Kelly | 2017-07-25 |
| 9662732 | Increasing solder hole-fill in a printed circuit board assembly | Matthew S. Kelly | 2017-05-30 |