| 8351158 |
Top bond pad for transducing head interconnect |
Jianxin Zhu, Lance E. Stover, Joel William Hoehn, Kevin J. Schulz |
2013-01-08 |
| 8254212 |
Integrated heat assisted magnetic recording device |
Tanya Jegeris Snyder, Scott Eugene Olson |
2012-08-28 |
| 7949218 |
Waveguide for heat assisted magnetic recording |
Edward Charles Gage, William Albert Challener, Mary Cynthia Hipwell, Michael Allen Seigler, Xuhui Jin +1 more |
2011-05-24 |
| 7929248 |
Top bond pad for transducing head interconnect |
Jianxin Zhu, Lance E. Stover, Joel William Hoehn, Kevin J. Schulz |
2011-04-19 |
| 7643248 |
Optoelectronic emitter mounted on a slider |
— |
2010-01-05 |
| 6985332 |
Head gimbal assembly with flex circuit arrangement between slider and head interconnect assembly |
David Gordon Qualey, Kevin J. Schulz, Gordon Jones |
2006-01-10 |
| 6728073 |
Flexible circuit designs with improved damping |
Richard August Budde |
2004-04-27 |
| 6704157 |
Passive damping method and circuit for data storage device actuator |
Adam Karl Himes, John Marc Wright, David Gordon Qualey |
2004-03-09 |
| 6600619 |
Vibration control of piezoelectric microactuator |
John C. Morris, Brian Molloy, John S. Wright |
2003-07-29 |
| 6590748 |
Combined servo-tracking and preload-controlling microactuator |
James M. Murphy, John S. Wright, David Gordon Qualey |
2003-07-08 |
| 6504669 |
Disc drive having charge feedback drive microactuator |
Donald W. Janz, John C. Morris, Brian Molloy, John S. Wright |
2003-01-07 |
| 6351353 |
Interconnect designs for micromotor, magnetic recording head and suspension assemblies |
David Gordon Qualey, Kevin J. Schultz |
2002-02-26 |
| 6233124 |
Piezoelectric microactuator suspension assembly with improved stroke length |
Richard August Budde, David Gordon Qualey, James M. Murphy |
2001-05-15 |
| 6078473 |
Gimbal flexure for use with microactuator |
Peter Crane, Adam Karl Himes, Kevin John Schulz, David Gordon Qualey |
2000-06-20 |
| 6046886 |
Flex circuit head interconnect with insulating spacer |
Adam Karl Himes, Kevin John Schulz, David Gordon Qualey |
2000-04-04 |
| 5873512 |
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
James D. Bielick, Mark K. Hoffmeyer, Phillip Duane Isaacs, Thomas D. Kidd |
1999-02-23 |
| 5806753 |
Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier |
James D. Bielick, Mark K. Hoffmeyer, Phillip Duane Isaacs, Thomas D. Kidd |
1998-09-15 |
| 5789930 |
Apparatus and method to test for known good die |
Phillip Duane Isaacs, Mark K. Hoffmeyer |
1998-08-04 |
| 5769989 |
Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement |
Mark K. Hoffmeyer |
1998-06-23 |
| 5601675 |
Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor |
Mark K. Hoffmeyer |
1997-02-11 |
