| 8730621 |
Solder ball bridge, and methods of making |
Jackson William Brandts, Christopher Unger |
2014-05-20 |
| 8351158 |
Top bond pad for transducing head interconnect |
Jianxin Zhu, David Allen Sluzewski, Lance E. Stover, Joel William Hoehn |
2013-01-08 |
| 7929248 |
Top bond pad for transducing head interconnect |
Jianxin Zhu, David Allen Sluzewski, Lance E. Stover, Joel William Hoehn |
2011-04-19 |
| 7130157 |
Head suspension having a displacement limiter |
Joseph H. Sassine, James R. Mahoney |
2006-10-31 |
| 6985332 |
Head gimbal assembly with flex circuit arrangement between slider and head interconnect assembly |
David Allen Sluzewski, David Gordon Qualey, Gordon Jones |
2006-01-10 |
| 6977798 |
Stiffened suspension for a storage device having a layer of composite material |
Marsha A. Huha, Sandeepan Bhattacharya |
2005-12-20 |
| 6927951 |
Flex on suspension with dissipative polymer substrate acting as bleed resistor for minimizing ESD damage |
Marsha A. Huha, Werner Weidemann |
2005-08-09 |
| 6867948 |
Disc drives having flexible circuits with liquid crystal polymer dielectric |
Adam Karl Himes |
2005-03-15 |
| 6765759 |
Resonance four piece suspension |
Sandeepan Bhattacharya, HaiMing Zhou, David Gordon Qualey |
2004-07-20 |
| 6757135 |
Leading edge bond pads |
Michael Louis Rancour, Ralph Kevin Smith |
2004-06-29 |
| 6714384 |
Reduced stiffness printed circuit head interconnect |
Adam Karl Himes |
2004-03-30 |
| 6036813 |
Method of making anisotropic conductive adhesive interconnects for head attachment in rigid disc drive device for manufacturing a groove bearing |
Cal E. Hardie, David Alan Zoz |
2000-03-14 |
| 5909342 |
Planar flexible circuit package for coupling transducers with carriage mounted circuitry |
Kent J. Forbord, Kenneth R. Fastner, John S. Putnam |
1999-06-01 |
| 5883759 |
Flex circuit head interconnect for improved electrical performance and ease of assembly |
— |
1999-03-16 |
| 5748412 |
Method and apparatus for protecting magnetoresistive sensor element from electrostatic discharge |
Edward S. Murdock, John C. Heitke |
1998-05-05 |