Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394625 | Fin field-effect transistor device and method of forming the same | Min-Hsiu Hung, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang | 2025-08-19 |
| 12310050 | Semiconductor structure and method of forming the same | Kan-Ju Lin, Chih-Shiun Chou, TaiMin Chang, Hung-Yi Huang, Chih-Wei Chang +2 more | 2025-05-20 |
| 12256549 | Boundary design to reduce memory array edge CMP dishing effect | Wei-Cheng Wu | 2025-03-18 |
| 12127399 | Array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Li-Feng Teng | 2024-10-22 |
| 12048163 | Trench gate high voltage transistor for embedded memory | Wei-Cheng Wu, Alexander Kalnitsky | 2024-07-23 |
| 12002867 | Contact structure for semiconductor device | Chia-Hung Chu, Shuen-Shin Liang, Hsu-Kai Chang, Tzu-Pei Chen, Kan-Ju Lin +2 more | 2024-06-04 |
| 11812616 | Trench gate high voltage transistor for embedded memory | Wei-Cheng Wu, Alexander Kalnitsky | 2023-11-07 |
| 11706914 | Method of forming an array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Li-Feng Teng | 2023-07-18 |
| 11424263 | Boundary design to reduce memory array edge CMP dishing effect | Wei-Cheng Wu | 2022-08-23 |
| 11264402 | Boundary design to reduce memory array edge CMP dishing effect | Wei-Cheng Wu | 2022-03-01 |
| 11211388 | Array boundfary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Li-Feng Teng | 2021-12-28 |
| 11189628 | Trench gate high voltage transistor for embedded memory | Wei-Cheng Wu, Alexander Kalnitsky | 2021-11-30 |
| 11177268 | Memory device and manufacturing method thereof | Wei-Cheng Wu | 2021-11-16 |
| 11107690 | Fin field-effect transistor device and method of forming the same | Min-Hsiu Hung, Yi-Hsiang Chao, Hung-Yi Huang, Chih-Wei Chang | 2021-08-31 |
| 10811426 | NVM memory HKMG integration technology | Wei-Cheng Wu | 2020-10-20 |
| 10515977 | Boundary design to reduce memory array edge CMP dishing effect | Wei-Cheng Wu | 2019-12-24 |
| 10276587 | NVM memory HKMG integration technology | Wei-Cheng Wu | 2019-04-30 |
| 9947676 | NVM memory HKMG integration technology | Wei-Cheng Wu | 2018-04-17 |
| 9812460 | NVM memory HKMG integration technology | Wei-Cheng Wu | 2017-11-07 |
| 9397112 | L-shaped capacitor in thin film storage technology | Harry-Hak-Lay Chuang, Wei-Cheng Wu | 2016-07-19 |