Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389672 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2025-08-12 |
| 12322715 | Method of forming integrated chip structure having slotted bond pad in stacked wafer structure | Harry-Hak-Lay Chuang, Wei-Cheng Wu | 2025-06-03 |
| 12255133 | Electrical fuse (e-fuse) one-time programmable (OTP) device and manufacturing method thereof | Alexander Kalnitsky, Wei-Cheng Wu, Harry-Hak-Lay Chuang, Chia-Wen Liang | 2025-03-18 |
| 12127399 | Array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Chien-Hung Chang | 2024-10-22 |
| 12096621 | Multi-type high voltage devices fabrication for embedded memory | Wei-Cheng Wu | 2024-09-17 |
| 12058856 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2024-08-06 |
| 12015029 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2024-06-18 |
| 11830875 | Method to embed planar FETS with FINFETS | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2023-11-28 |
| 11825651 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-11-21 |
| 11758721 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-09-12 |
| 11742348 | Semiconductor device and method for forming the same | Wei-Cheng Wu, Harry-Hak-Lay Chuang, Li-Jung Liu | 2023-08-29 |
| 11706914 | Method of forming an array boundary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Chien-Hung Chang | 2023-07-18 |
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Fang-Lan Chu, Ya-Chen Kao | 2023-03-07 |
| 11594620 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2023-02-28 |
| 11355493 | Method to embed planar FETs with finFETs | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Li-Jung Liu | 2022-06-07 |
| 11282846 | Mask design for embedded memory | Wei-Cheng Wu | 2022-03-22 |
| 11264396 | Multi-type high voltage devices fabrication for embedded memory | Wei-Cheng Wu | 2022-03-01 |
| 11211388 | Array boundfary structure to reduce dishing | Meng-Han Lin, Te-Hsin Chiu, Wei-Cheng Wu, Chien-Hung Chang | 2021-12-28 |
| 10950611 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2021-03-16 |
| 10950715 | Method of manufacturing semiconductor device including non-volatile memories and logic devices | Wei-Cheng Wu | 2021-03-16 |
| 10943996 | Method of manufacturing semiconductor device including non-volatile memories and logic devices | Wei-Cheng Wu | 2021-03-09 |
| 10879253 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2020-12-29 |
| 10325918 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2019-06-18 |
| 10325919 | Mask design for embedded memory | Wei-Cheng Wu | 2019-06-18 |
| 10283512 | Semiconductor device and manufacturing method thereof | Wei-Cheng Wu | 2019-05-07 |