Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381158 | Wafer bonding method and bonded device structure | Harry Chuang, Yuan-Jen Lee, Nuo Xu, Wei-Cheng Wu | 2025-08-05 |
| 11600618 | Integrated circuit structure and manufacturing method thereof | Harry-Hak-Lay Chuang, Li-Feng Teng, Wei-Cheng Wu, Ya-Chen Kao | 2023-03-07 |
| 11069419 | Test line letter for embedded non-volatile memory technology | Jui-Tsung Lien, Hong-Da Lin, Wei-Cheng Wu, Ku-Ning Chang, Yu-Chen Wang | 2021-07-20 |
| 10163522 | Test line letter for embedded non-volatile memory technology | Jui-Tsung Lien, Hong-Da Lin, Wei-Cheng Wu, Ku-Ning Chang, Yu-Chen Wang | 2018-12-25 |
| 9983257 | Test line patterns in split-gate flash technology | Wei-Cheng Wu, Jui-Tsung Lien, Hong-Da Lin, Ku-Ning Chang, Yu-Chen Wang | 2018-05-29 |
| 9425206 | Boundary scheme for embedded poly-SiON CMOS or NVM in HKMG CMOS technology | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Ya-Chen Kao, Shih-Chang Liu | 2016-08-23 |
| 9276010 | Dual silicide formation method to embed split gate flash memory in high-k metal gate (HKMG) technology | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Ya-Chen Kao | 2016-03-01 |