Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641717 | Soldering of end chip components in series | John R. Dangler, Theron Lee Lewis, David J. Braun | 2023-05-02 |
| 8613626 | Dual level contact design for an interconnect system in power applications | — | 2013-12-24 |