Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10073134 | Laminate bond strength detection | Stephen M. Hugo | 2018-09-11 |
| 9910085 | Laminate bond strength detection | Stephen M. Hugo | 2018-03-06 |
| 9402320 | Electronic component assembly | Mark K. Hoffmeyer | 2016-07-26 |
| 9059373 | Protecting a thermal sensitive component in a thermal process | Cliff Chen, Ben Chiu, Michk Huang | 2015-06-16 |
| 7975379 | Method of making a land-grid-array (LGA) interposer | Gareth G. Hougham, Brian S. Beaman, John Saunders Corbin, Jr., Paul W. Coteus, Shawn A. Hall +3 more | 2011-07-12 |
| 7632127 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Amanda E. Mikhail, Arvind K. Sinha | 2009-12-15 |
| 7530853 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Amanda E. Mikhail, Arvind K. Sinha | 2009-05-12 |
| 7472477 | Method for manufacturing a socket that compensates for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Amanda E. Mikhail, Arvind K. Sinha | 2009-01-06 |
| 7303443 | Socket and method for compensating for differing coefficients of thermal expansion | Brian S. Beaman, Joseph Kuczynski, Amanda E. Mikhail, Arvind K. Sinha | 2007-12-04 |