MH

Mark K. Hoffmeyer

IBM: 85 patents #762 of 70,183Top 2%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
WARF: 1 patents #1,912 of 4,123Top 50%
Oracle: 1 patents #8,282 of 14,854Top 60%
📍 Rochester, MN: #41 of 3,042 inventorsTop 2%
🗺 Minnesota: #260 of 52,454 inventorsTop 1%
Overall (All Time): #18,358 of 4,157,543Top 1%
89
Patents All Time

Issued Patents All Time

Showing 26–50 of 89 patents

Patent #TitleCo-InventorsDate
10653037 Thermal interface material structures Phillip V. Mann 2020-05-12
10607859 Adhesive-bonded thermal interface structures Karl Stathakis, Phillip V. Mann 2020-03-31
10319609 Adhesive-bonded thermal interface structures Karl Stathakis, Phillip V. Mann 2019-06-11
10304699 Adhesive-bonded thermal interface structures Karl Stathakis, Phillip V. Mann 2019-05-28
10236189 Adhesive-bonded thermal interface structures for integrated circuit cooling Karl Stathakis, Phillip V. Mann 2019-03-19
10182514 Thermal interface material structures Phillip V. Mann 2019-01-15
10168383 Testing printed circuit board assembly Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly 2019-01-01
10111322 Implementing reworkable strain relief packaging structure for electronic component interconnects 2018-10-23
10048312 Testing printed circuit board assembly Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly 2018-08-14
9913361 Integrated circuit device assembly David Barron, Jason R. Eagle, Roger Duane Hamilton, Christopher W. Mann, Matthew T. Richardson 2018-03-06
9647356 Eye-of-needle compliant pin 2017-05-09
9640934 Twisted eye-of-needle compliant pin 2017-05-02
9609744 Area array device connection structures with complimentary warp characteristics Amanda E. Mikhail, Arvind K. Sinha 2017-03-28
9537234 Method of making a solder tail extender connector William L. Brodsky, John R. Dangler, Timothy P. Younger 2017-01-03
9472877 Twisted eye-of-needle compliant pin 2016-10-18
9472876 Eye-of-needle compliant pin 2016-10-18
9402320 Electronic component assembly Theron Lee Lewis 2016-07-26
9247636 Area array device connection structures with complimentary warp characteristics Amanda E. Mikhail, Arvind K. Sinha 2016-01-26
8864536 Implementing hybrid molded solder-embedded pin contacts and connectors 2014-10-21
8680670 Multi-chip module system with removable socketed modules Jon A. Casey, John L. Colbert, Paul M. Harvey, Charles L. Reynolds 2014-03-25
8326754 Method and system for processing transactions David W. Bandych, John T. Marron, Michael Barnes, Tim Dawson, Paul Hanson 2012-12-04
8267701 Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing Brian S. Beaman, William L. Brodsky, John L. Colbert, Yuet-Ying Yu 2012-09-18
8212156 Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction William L. Brodsky 2012-07-03
8179693 Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements William L. Brodsky 2012-05-15
8085550 Implementing enhanced solder joint robustness for SMT pad structure Steven P. Ostrander, Sri M. Sri-Jayantha 2011-12-27