Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7985095 | Implementing enhanced connector guide block structures for robust SMT assembly | William L. Brodsky, John L. Colbert | 2011-07-26 |
| 7944698 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha | 2011-05-17 |
| 7856341 | Heat sink | Brian L. Carlson, Bruce J. Chamberlin, Ahmad D. Katnani, Matthew S. Kelly, Gregory S. Killinger +3 more | 2010-12-21 |
| 7658617 | Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer | William L. Brodsky | 2010-02-09 |
| 7606033 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha | 2009-10-20 |
| 7517230 | Customizable backer for achieving consistent loading and engagement of array package connections | John L. Colbert | 2009-04-14 |
| 7486516 | Mounting a heat sink in thermal contact with an electronic component | John L. Colbert, Eric A. Eckberg, Roger Duane Hamilton, Amanda E. Mikhail, Arvind K. Sinha | 2009-02-03 |
| 7435622 | High performance reworkable heatsink and packaging structure with solder release layer and method of making | John L. Colbert | 2008-10-14 |
| 7399185 | Customizable backer for achieving consistent loading and engagement of array package connections | John L. Colbert | 2008-07-15 |
| 7342306 | High performance reworkable heatsink and packaging structure with solder release layer | John L. Colbert | 2008-03-11 |
| 7197818 | Method and structures for implementing customizable dielectric printed circuit card traces | Todd A. Cannon, William Csongradi, Benjamin A. Fox, Roger J. Gravrok, David L. Pease +1 more | 2007-04-03 |
| 7199309 | Structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Wai Mon Ma, Arch Nuttall, James R. Stack | 2007-04-03 |
| 7173193 | Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board | William L. Brodsky, James R. Stack | 2007-02-06 |
| 7129417 | Method and structures for implementing customizable dielectric printed circuit card traces | Todd A. Cannon, William Csongradi, Benjamin A. Fox, Roger J. Gravrok, David L. Pease +1 more | 2006-10-31 |
| 7079398 | Sash for land grid arrays | — | 2006-07-18 |
| 6912780 | Method and structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Wai Mon Ma, Arch Nuttall, James R. Stack | 2005-07-05 |
| 6784377 | Method and structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Wai Mon Ma, Arch Nuttall, James R. Stack | 2004-08-31 |
| 6711026 | Sash for land grid arrays | — | 2004-03-23 |
| 6700068 | Adhesive-less cover on area array bonding site of circuit board | Daniel Scott Johnson | 2004-03-02 |
| 6499215 | Processing of circuit boards with protective, adhesive-less covers on area array bonding sites | Daniel Scott Johnson | 2002-12-31 |
| 6497582 | LGA connector with integrated gasket | — | 2002-12-24 |
| 6300578 | Pad-on-via assembly technique | Phillip Duane Isaacs | 2001-10-09 |
| 6134776 | Heatsink and package structure for wirebond chip rework and replacement | — | 2000-10-24 |
| 6127731 | Capped solder bumps which form an interconnection with a tailored reflow melting point | — | 2000-10-03 |
| 6084775 | Heatsink and package structures with fusible release layer | Gerald K. Bartley, Douglas A. Baska, James D. Bielick, Matthew A. Butterbaugh, Sukhvinder S. Kang | 2000-07-04 |