James R. Stack — 13 Patents at IBM

James R. Stack has been granted 13 US patents while listed as an inventor at IBM. The first was granted in 2000 and the most recent in April 2007. James R. Stack ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list James R. Stack in Endicott, NY, US.

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
7199309	Structure for repairing or modifying surface connections on circuit boards	Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall	2007-04-03	$7,379,000
7173193	Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board	William L. Brodsky, Mark K. Hoffmeyer	2007-02-06	$8,225,000
6912780	Method and structure for repairing or modifying surface connections on circuit boards	Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall	2005-07-05	$5,545,000
6832436	Method for forming a substructure of a multilayered laminate	Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more	2004-12-21	$10,287,000
6784377	Method and structure for repairing or modifying surface connections on circuit boards	Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall	2004-08-31	$4,873,000
6593534	Printed wiring board structure with z-axis interconnections	Gerald W. Jones, John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti +1 more	2003-07-15	$18,764,000
6576013	Eye prosthesis	Mark Budman	2003-06-10	$13,477,000
6565367	Zero insertion force compliant pin contact and assembly	Mark Budman, Bruce J. Chamberlin, Li Li	2003-05-20	$14,158,000
6426466	Peripheral power board structure	Bruce J. Chamberlin, John M. Lauffer	2002-07-30	$10,205,000
6407341	Conductive substructures of a multilayered laminate	Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more	2002-06-18	$15,516,000
6232564	Printed wiring board wireability enhancement	Steven F. Arndt, Mark Budman	2001-05-15	$34,251,000
6150061	Clover-leaf solder mask opening	—	2000-11-21	$39,339,000
6078013	Clover-leaf solder mask opening	—	2000-06-20	$29,799,000

James R. Stack — 13 Patents

Issued Patents All Time

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