Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7199309 | Structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall | 2007-04-03 |
| 7173193 | Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board | William L. Brodsky, Mark K. Hoffmeyer | 2007-02-06 |
| 6912780 | Method and structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall | 2005-07-05 |
| 6832436 | Method for forming a substructure of a multilayered laminate | Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more | 2004-12-21 |
| 6784377 | Method and structure for repairing or modifying surface connections on circuit boards | Bruce J. Chamberlin, Mark K. Hoffmeyer, Wai Mon Ma, Arch Nuttall | 2004-08-31 |
| 6593534 | Printed wiring board structure with z-axis interconnections | Gerald W. Jones, John M. Lauffer, Voya R. Markovich, Thomas R. Miller, James P. Paoletti +1 more | 2003-07-15 |
| 6576013 | Eye prosthesis | Mark Budman | 2003-06-10 |
| 6565367 | Zero insertion force compliant pin contact and assembly | Mark Budman, Bruce J. Chamberlin, Li Li | 2003-05-20 |
| 6426466 | Peripheral power board structure | Bruce J. Chamberlin, John M. Lauffer | 2002-07-30 |
| 6407341 | Conductive substructures of a multilayered laminate | Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich +2 more | 2002-06-18 |
| 6232564 | Printed wiring board wireability enhancement | Steven F. Arndt, Mark Budman | 2001-05-15 |
| 6150061 | Clover-leaf solder mask opening | — | 2000-11-21 |
| 6078013 | Clover-leaf solder mask opening | — | 2000-06-20 |