DA

Donald O. Anstrom

IBM: 4 patents #21,733 of 70,183Top 35%
📍 Endicott, NY: #176 of 620 inventorsTop 30%
🗺 New York: #31,572 of 115,490 inventorsTop 30%
Overall (All Time): #1,262,248 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
6894228 High performance dense wire for printed circuit board Bruce J. Chamberlin, John M. Lauffer, Voya R. Markovich, David L. Thomas 2005-05-17
6832436 Method for forming a substructure of a multilayered laminate Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich, Douglas O. Powell +2 more 2004-12-21
6495772 High performance dense wire for printed circuit board Bruce J. Chamberlin, John M. Lauffer, Voya R. Markovich, David L. Thomas 2002-12-17
6407341 Conductive substructures of a multilayered laminate Bruce J. Chamberlin, James W. Fuller, John M. Lauffer, Voya R. Markovich, Douglas O. Powell +2 more 2002-06-18