| 9459285 |
Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly |
— |
2016-10-04 |
| 8939791 |
Primary circuit board non-conductive void having different planar dimensions through board thickness to secure non-conducting locking member of holder |
James Edward Tersigni, Jefferson L. Watson |
2015-01-27 |
| 8902605 |
Adapter for plated through hole mounting of surface mount component |
Daniel J. Buschel, James Edward Tersigni, Raymond D. Birchall |
2014-12-02 |
| 8638564 |
Dye-based circuit mount testing |
Daniel J. Buschel, Donald A. Merte |
2014-01-28 |
| 7841078 |
Method of optimizing land grid array geometry |
Roger Lam, Arch Nuttall |
2010-11-30 |
| 7199309 |
Structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Arch Nuttall, James R. Stack |
2007-04-03 |
| 6974071 |
Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components |
Todd H. Buley, Brian D. Chapman, Roger Lam, John P. Weir |
2005-12-13 |
| 6912780 |
Method and structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Arch Nuttall, James R. Stack |
2005-07-05 |
| 6784377 |
Method and structure for repairing or modifying surface connections on circuit boards |
Bruce J. Chamberlin, Mark K. Hoffmeyer, Arch Nuttall, James R. Stack |
2004-08-31 |
| 6511347 |
Terminating floating signals on a BGA module to a ground plane on a ball grid array (BGA) circuit board site |
Brian D. Chapman |
2003-01-28 |
| 6437252 |
Method and structure for reducing power noise |
Simone Rehm, Roland Frech, Erich Klink, Helmut Virag, Thomas-Michael Winkel +2 more |
2002-08-20 |
| 6182884 |
Method and apparatus for reworking ceramic ball grid array or ceramic column grid array on circuit cards |
James J. Petrone |
2001-02-06 |
| 6059172 |
Method for establishing electrical communication between a first object having a solder ball and a second object |
Brian D. Chapman, James J. Petrone |
2000-05-09 |
| 6050481 |
Method of making a high melting point solder ball coated with a low melting point solder |
Brian D. Chapman, James J. Petrone |
2000-04-18 |
| 6016947 |
Non-destructive low melt test for off-composition solder |
Timothy W. Donahue, Ellyn M. Ingalls, Chon Cheong Lei, Horatio Quinones, Charles L. Reynolds +1 more |
2000-01-25 |
| 5909011 |
Method and apparatus for modifying circuit having ball grid array interconnections |
Richard L. Chartrand, Roger A. Stinemire |
1999-06-01 |
| 5890284 |
Method for modifying circuit having ball grid array interconnections |
Richard L. Chartrand, Roger A. Stinemire |
1999-04-06 |
| 5872400 |
High melting point solder ball coated with a low melting point solder |
Brian D. Chapman, James J. Petrone |
1999-02-16 |
| 4953929 |
Fiber optic connector assembly and adapter for use therewith |
Joseph F. Basista, John J. Squires |
1990-09-04 |
| 4907975 |
Electrical connector utilizing flexible electrical circuitry |
David W. Dranchak, David E. Engle, David Hessian, Alan D. Knight, Thomas G. Macek +1 more |
1990-03-13 |
