Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974071 | Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components | Brian D. Chapman, Roger Lam, Wai Mon Ma, John P. Weir | 2005-12-13 |
| 6711810 | Method of assembling a land grid array module | Roger Lam, Daniel O'Connor, Charles H. Perry | 2004-03-30 |