Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6965171 | Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules | Tim H. Lee, Donald J. Papae, Francis F. Szenher | 2005-11-15 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components | Peter A. Gruber, Minkailu A Jalloh | 2005-06-28 |
| 6800141 | Semi-aqueous solvent based method of cleaning rosin flux residue | Krishna G. Sachdev, Demian M. Riccardi | 2004-10-05 |
| 6742530 | Semi-aqueous solvent cleaning of paste processing residue from substrates | Krishna G. Sachdev, James N. Humenik, Glenn A. Pomerantz | 2004-06-01 |
| 6708872 | Method and apparatus for applying solder to an element on a substrate | Peter A. Gruber | 2004-03-23 |
| 6652665 | Method of removing silicone polymer deposits from electronic components | Krishna G. Sachdev, Umar M. Ahmad | 2003-11-25 |
| 6569252 | Semi-aqueous solvent cleaning of paste processing residue from substrates | Krishna G. Sachdev, James N. Humenik, Glenn A. Pomerantz | 2003-05-27 |
| 6503874 | Cleaning method to remove flux residue in electronic assembly | Krishna G. Sachdev | 2003-01-07 |
| 6491205 | Assembly of multi-chip modules using eutectic solders | Jac A. Burke, William F. Beausoleil, N. James Tomassetti, Lawrence A. Thomas, Tak-kwong Ng +1 more | 2002-12-10 |
| 6448796 | Selective netlist to test fine pitch multi-chip semiconductor | John J. Ellison, Jorge Rivera | 2002-09-10 |
| 6425518 | Method and apparatus for applying solder to an element on a substrate | Peter A. Gruber | 2002-07-30 |
| 6276596 | Low temperature solder column attach by injection molded solder and structure formed | Peter A. Gruber, Lannie R. Bolde, Guy Paul Brouillette, James H. Covell, David Danovitch | 2001-08-21 |
| 6153505 | Plastic solder array using injection molded solder | Lannie R. Bolde, Peter A. Gruber | 2000-11-28 |
| 6029882 | Plastic solder array using injection molded solder | Lannie R. Bolde, Peter A. Gruber | 2000-02-29 |
| 6016947 | Non-destructive low melt test for off-composition solder | Timothy W. Donahue, Ellyn M. Ingalls, Wai Mon Ma, Horatio Quinones, Charles L. Reynolds +1 more | 2000-01-25 |
| 5938856 | Process of removing flux residue from microelectronic components | Krishna G. Sachdev, Umar M. Ahmad, John U. Knickerbocker | 1999-08-17 |
| 5913985 | Fixture and method for securing electronic modules during wet processing | Lannie R. Bolde, Donn Allan Lord | 1999-06-22 |