Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components | Peter A. Gruber, Chon Cheong Lei | 2005-06-28 |
| 6051119 | Plating structure for a pin grid array package | Paul F. Findeis, Kenneth R. Idler, Thomas A. Kelly, Emanuele F. Lopergolo | 2000-04-18 |