Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705396 | Method to form air gap structure with dual dielectric layer | Vincent J. McGahay, Craig R. Gruszecki, Ju Jin An, Todd J. Van Kleeck | 2023-07-18 |
| 11127678 | Dual dielectric layer for closing seam in air gap structure | Vincent J. McGahay, Craig R. Gruszecki, Ju Jin An, Todd J. Van Kleeck | 2021-09-21 |
| 6965171 | Method and structure for selective thermal paste deposition and retention on integrated circuit chip modules | Chon Cheong Lei, Donald J. Papae, Francis F. Szenher | 2005-11-15 |