| 7989229 |
Tactile surface inspection during device fabrication or assembly |
— |
2011-08-02 |
| 7806312 |
Method and apparatus for removing known good die |
Lannie R. Bolde, Mark W. Kapfhammer |
2010-10-05 |
| 7168609 |
Method and apparatus for removing known good die |
Lannie R. Bolde, Mark W. Kapfhammer |
2007-01-30 |
| 6964885 |
Stress resistant land grid array (LGA) module and method of forming the same |
Patrick A. Coico, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more |
2005-11-15 |
| 6703560 |
Stress resistant land grid array (LGA) module and method of forming the same |
Patrick A. Coico, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering, Sundar M. Kamath +4 more |
2004-03-09 |
| 6333209 |
One step method for curing and joining BGA solder balls |
Patrick A. Coico, Lewis S. Goldmann, Kimberly A. Kelly |
2001-12-25 |
| 6276596 |
Low temperature solder column attach by injection molded solder and structure formed |
Peter A. Gruber, Lannie R. Bolde, Guy Paul Brouillette, David Danovitch, Chon Cheong Lei |
2001-08-21 |
| 6278193 |
Optical sensing method to place flip chips |
Patrick A. Coico |
2001-08-21 |
| 5982038 |
Cast metal seal for semiconductor substrates |
Hilton T. Toy, Lannie R. Bolde, David L. Edwards, Lewis S. Goldmann, Peter A. Gruber |
1999-11-09 |
| 5971058 |
Apparatus and method for continuous casting solder onto discrete parts |
Lannie R. Bolde |
1999-10-26 |
| 5968670 |
Enhanced ceramic ball grid array using in-situ solder stretch with spring |
Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +6 more |
1999-10-19 |
| 5961032 |
Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold |
Shaji Farooq, Peter A. Gruber, Sudipta K. Ray |
1999-10-05 |
| 5821161 |
Cast metal seal for semiconductor substrates and process thereof |
Lannie R. Bolde, David L. Edwards, Lewis S. Goldmann, Peter A. Gruber, Hilton T. Toy |
1998-10-13 |
| 5718361 |
Apparatus and method for forming mold for metallic material |
Carol J. Braun |
1998-02-17 |
| 5718367 |
Mold transfer apparatus and method |
Carol J. Braun |
1998-02-17 |
| 5504612 |
Synchronized XY laser scanner |
Joshua Monroe Cobb, Franz X. Topolovec, Uldis A. Ziemins |
1996-04-02 |
