Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6964885 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2005-11-15 |
| 6703560 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2004-03-09 |
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | David Chazan, Jan Strandberg, Solomon I. Beilin | 2003-01-21 |
| 6317331 | Wiring substrate with thermal insert | David Chazan, Solomon I. Beilin | 2001-11-13 |
| 6312791 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Scott I. Langenthal, Srinivasa S. N. Reddy +1 more | 2001-11-06 |
| 6299053 | Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch | David Chazan, Jan Strandberg, Solomon I. Beilin | 2001-10-09 |
| 6261467 | Direct deposit thin film single/multi chip module | Ajay P. Giri, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski +1 more | 2001-07-17 |
| 6258191 | Method and materials for increasing the strength of crystalline ceramic | Benjamin V. Fasano, Lewis S. Goldmann, Richard F. Indyk, Scott I. Langenthal, Srinivasa S. N. Reddy | 2001-07-10 |
| 6187418 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Scott I. Langenthal, Srinivasa S. N. Reddy +1 more | 2001-02-13 |
| 6139666 | Method for producing ceramic surfaces with easily removable contact sheets | Benjamin V. Fasano, Richard F. Indyk, Scott I. Langenthal, Srinivasa S. N. Reddy | 2000-10-31 |
| 6136419 | Ceramic substrate having a sealed layer | Benjamin V. Fasano, Richard F. Indyk, John U. Knickerbocker, Scott I. Langenthal, Daniel O'Connor +1 more | 2000-10-24 |
| 6037044 | Direct deposit thin film single/multi chip module | Ajay P. Giri, Daniel O'Connor, Rajesh B. Patel, Herbert I. Stoller, Lisa M. Studzinski +1 more | 2000-03-14 |
| 5976710 | Low TCE polyimides as improved insulator in multilayer interconnect structures | Krishna G. Sachdev, John P. Hummel, Robert N. Lang, Anton Nendaic, Charles H. Perry +1 more | 1999-11-02 |