Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519875 | Sensor device, measuring system and measuring method for detecting presence of liquid and/or humidity | Duncan Platt | 2022-12-06 |
| 6953999 | High density chip level package for the packaging of integrated circuits and method to manufacture same | Richard Trevino, Thomas Blount | 2005-10-11 |
| 6872589 | High density chip level package for the packaging of integrated circuits and method to manufacture same | Richard Trevino, Thomas Blount | 2005-03-29 |
| 6586682 | Printed wiring board with controlled line impedance | — | 2003-07-01 |
| 6509529 | Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch | Sundar M. Kamath, David Chazan, Solomon I. Beilin | 2003-01-21 |
| 6440641 | Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates | James L. Lykins | 2002-08-27 |
| 6323435 | Low-impedance high-density deposited-on-laminate structures having reduced stress | David Chazan, Michael P. Skinner | 2001-11-27 |
| 6299053 | Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch | Sundar M. Kamath, David Chazan, Solomon I. Beilin | 2001-10-09 |
| 6282865 | Apparatus for applying drinking straws | Jan-Ake Bergstrom, Jens Quist, Johan Ohlund | 2001-09-04 |
| 6203967 | Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base | Scott M. Westbrook | 2001-03-20 |
| 6165892 | Method of planarizing thin film layers deposited over a common circuit base | David Chazan, Ted Chen, Todd Kaplan, James L. Lykins, Michael P. Skinner | 2000-12-26 |