Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6953999 | High density chip level package for the packaging of integrated circuits and method to manufacture same | Jan Strandberg, Richard Trevino | 2005-10-11 |
| 6872589 | High density chip level package for the packaging of integrated circuits and method to manufacture same | Jan Strandberg, Richard Trevino | 2005-03-29 |