SL

Scott I. Langenthal

IBM: 12 patents #9,222 of 70,183Top 15%
Overall (All Time): #426,025 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6984792 Dielectric interposer for chip to substrate soldering Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2006-01-10
6657313 Dielectric interposer for chip to substrate soldering Peter J. Brofman, Shaji Faroon, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2003-12-02
6559527 Process for forming cone shaped solder for chip interconnection Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2003-05-06
6529021 Self-scrub buckling beam probe Yuet-Ying Yu, Daniel G. Berger, Camille P. Bowne, Charles H. Perry, Terence W. Spoor +1 more 2003-03-04
6376054 Surface metallization structure for multiple chip test and burn-in Thomas E. Lombardi, Richard F. Indyk, John U. Knickerbocker, Srinivasa S. N. Reddy, Richard A. Shelleman +2 more 2002-04-23
6312791 Multilayer ceramic substrate with anchored pad Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Srinivasa S. N. Reddy +1 more 2001-11-06
6258191 Method and materials for increasing the strength of crystalline ceramic Benjamin V. Fasano, Lewis S. Goldmann, Richard F. Indyk, Sundar M. Kamath, Srinivasa S. N. Reddy 2001-07-10
6220499 Method for assembling a chip carrier to a semiconductor device Peter J. Brofman, Shaji Faroog, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2001-04-24
6187418 Multilayer ceramic substrate with anchored pad Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Srinivasa S. N. Reddy +1 more 2001-02-13
6184062 Process for forming cone shaped solder for chip interconnection Peter J. Brofman, Shaji Farooq, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter 2001-02-06
6139666 Method for producing ceramic surfaces with easily removable contact sheets Benjamin V. Fasano, Richard F. Indyk, Sundar M. Kamath, Srinivasa S. N. Reddy 2000-10-31
6136419 Ceramic substrate having a sealed layer Benjamin V. Fasano, Richard F. Indyk, Sundar M. Kamath, John U. Knickerbocker, Daniel O'Connor +1 more 2000-10-24