LG

Lewis S. Goldman

IBM: 2 patents #32,839 of 70,183Top 50%
📍 Bedford, NY: #31 of 77 inventorsTop 45%
🗺 New York: #48,759 of 115,490 inventorsTop 45%
Overall (All Time): #2,184,819 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6964885 Stress resistant land grid array (LGA) module and method of forming the same Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Ronald L. Hering, Sundar M. Kamath +4 more 2005-11-15
6703560 Stress resistant land grid array (LGA) module and method of forming the same Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Ronald L. Hering, Sundar M. Kamath +4 more 2004-03-09