MH

Mark K. Hoffmeyer

IBM: 85 patents #762 of 70,183Top 2%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
WARF: 1 patents #1,912 of 4,123Top 50%
Oracle: 1 patents #8,282 of 14,854Top 60%
📍 Rochester, MN: #41 of 3,042 inventorsTop 2%
🗺 Minnesota: #260 of 52,454 inventorsTop 1%
Overall (All Time): #18,358 of 4,157,543Top 1%
89
Patents All Time

Issued Patents All Time

Showing 76–89 of 89 patents

Patent #TitleCo-InventorsDate
6076726 Pad-on-via assembly technique Phillip Duane Isaacs 2000-06-20
6024580 High performance pad on pad connector for flex circuit packaging John R. Dangler, Thomas D. Kidd, Miles Frank Swain 2000-02-15
5910644 Universal surface finish for DCA, SMT and pad on pad interconnections Dale E. Goodman, Roger S. Krabbenhoft 1999-06-08
5873512 Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier James D. Bielick, Phillip Duane Isaacs, Thomas D. Kidd, David Allen Sluzewski 1999-02-23
5806753 Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier James D. Bielick, Phillip Duane Isaacs, Thomas D. Kidd, David Allen Sluzewski 1998-09-15
5789930 Apparatus and method to test for known good die Phillip Duane Isaacs, David Allen Sluzewski 1998-08-04
5769989 Method and system for reworkable direct chip attach (DCA) structure with thermal enhancement David Allen Sluzewski 1998-06-23
5757073 Heatsink and package structure for wirebond chip rework and replacement 1998-05-26
5757998 Multigigabit adaptable transceiver module Raymond J. Thatcher, David Peter Gaio, Sukhvinder S. Kang 1998-05-26
5651493 Method of performing solder joint analysis of semi-conductor components James D. Bielick, Phillip Duane Isaacs 1997-07-29
5632438 Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization Gregg A. Knotts, Connie Jean Mathison 1997-05-27
5601675 Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor David Allen Sluzewski 1997-02-11
H1471 Metal substrate double sided circuit board David J. Braun, Charles J. Guenther, James A. Hagan, Steven D. Keidl, Timothy C. Daun-Lindberg +2 more 1995-08-01
5066324 Method of evaluation and identification for the design of effective inoculation agents John H. Perepezko 1991-11-19