Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member

Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member

US Patent 7293994 · Granted Nov 13, 2007

Estimated economic value: $7,366,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Rotating lid for module cooler2024
Card retention connector system2024
Temporary removable module lid2023
Card retention connector system2023
Tamper-respondent assemblies with pressure connector assemblies2023
Hybrid cable assembly2023
On-demand testing for selected conditions2021
Implementing IR reflective mask to minimize CTE mismatch between laminate and PT2021
Tamper-respondent sensors with liquid crystal polymer layers2021
Airflow balancing assembly2021
Acoustic attenuating ear muffs with mechanically actuated attenuation plugs2021
Enclosure with tamper respondent sensor2021