| 11076493 |
Implementing high-speed signaling via dedicated printed circuit-board media |
Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar |
2021-07-27 |
$4,187,000 |
| 10765002 |
Electronic module power supply |
Michael A. Christo, Julio A. Maldonado, Tingdong Zhou |
2020-09-01 |
$3,521,000 |
| 10375820 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling |
2019-08-06 |
$1,880,000 |
| 10362674 |
Electronic module power supply |
Michael A. Christo, Julio A. Maldonado, Tingdong Zhou |
2019-07-23 |
$2,519,000 |
| 10080285 |
Electronic module power supply |
Michael A. Christo, Julio A. Maldonado, Tingdong Zhou |
2018-09-18 |
$3,379,000 |
| 10034393 |
Implementing high-speed signaling via dedicated printed circuit-board media |
Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar |
2018-07-24 |
$2,645,000 |
| 9955567 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling |
2018-04-24 |
$2,845,000 |
| 9456498 |
Electronic module power supply |
Michael A. Christo, Julio A. Maldonado, Tingdong Zhou |
2016-09-27 |
$4,099,000 |
| 8962475 |
Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density |
Sungjun Chun, Anand Haridass |
2015-02-24 |
$3,851,000 |
| 8958214 |
Motherboard assembly for interconnecting and distributing signals and power |
John L. Colbert, Arvind K. Sinha |
2015-02-17 |
$5,211,000 |
| 8927879 |
Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures |
Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling |
2015-01-06 |
$2,134,000 |
| 8813000 |
System for designing substrates having reference plane voids with strip segments |
Sungjun Chun, Anand Haridass |
2014-08-19 |
$3,895,000 |
| 8742565 |
Ball grid array with improved single-ended and differential signal performance |
Yaping Zhou |
2014-06-03 |
$4,638,000 |
| 8645889 |
Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules |
Jinwoo Choi, Sungjun Chun, Anand Haridass |
2014-02-04 |
$4,435,000 |
| 8638567 |
Circuit manufacturing and design techniques for reference plane voids with strip segment |
Sungjun Chun, Anand Haridass |
2014-01-28 |
$3,630,000 |
| 8624297 |
Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density |
Sungjun Chun, Anand Haridass |
2014-01-07 |
$4,729,000 |
| 8625300 |
Circuit manufacturing and design techniques for reference plane voids with strip segment |
Sungjun Chun, Anand Haridass |
2014-01-07 |
$4,729,000 |
| 8619432 |
Implementing high-speed signaling via dedicated printed circuit-board media |
Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar |
2013-12-31 |
$6,686,000 |
| 8593621 |
Testing an optical fiber connection |
Kevin Bills, Mahesh Bohra, Hong T. Dang, Rohan U. Mandrekar |
2013-11-26 |
$4,812,000 |
| 8572840 |
Method of attaching an electronic module power supply |
Michael A. Christo, Julio A. Maldonado, Tingdong Zhou |
2013-11-05 |
$5,290,000 |
| 8514583 |
System and method for multi-application socket |
— |
2013-08-20 |
$3,918,000 |
| 8451020 |
System and method for integrated circuit module tamperproof mode personalization |
— |
2013-05-28 |
$7,454,000 |
| 8446738 |
Motherboard assembly for interconnecting and distributing signals and power |
John L. Colbert, Arvind K. Sinha |
2013-05-21 |
$6,083,000 |
| 8399981 |
Ball grid array with improved single-ended and differential signal performance |
Yaping Zhou |
2013-03-19 |
$8,741,000 |
| 8338948 |
Ball grid array with improved single-ended and differential signal performance |
Yaping Zhou |
2012-12-25 |
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