Issued Patents All Time
Showing 25 most recent of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076493 | Implementing high-speed signaling via dedicated printed circuit-board media | Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar | 2021-07-27 |
| 10765002 | Electronic module power supply | Michael A. Christo, Julio A. Maldonado, Tingdong Zhou | 2020-09-01 |
| 10375820 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling | 2019-08-06 |
| 10362674 | Electronic module power supply | Michael A. Christo, Julio A. Maldonado, Tingdong Zhou | 2019-07-23 |
| 10080285 | Electronic module power supply | Michael A. Christo, Julio A. Maldonado, Tingdong Zhou | 2018-09-18 |
| 10034393 | Implementing high-speed signaling via dedicated printed circuit-board media | Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar | 2018-07-24 |
| 9955567 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling | 2018-04-24 |
| 9456498 | Electronic module power supply | Michael A. Christo, Julio A. Maldonado, Tingdong Zhou | 2016-09-27 |
| 8962475 | Multi-layer circuit substrate fabrication method providing improved transmission line integrity and increased routing density | Sungjun Chun, Anand Haridass | 2015-02-24 |
| 8958214 | Motherboard assembly for interconnecting and distributing signals and power | John L. Colbert, Arvind K. Sinha | 2015-02-17 |
| 8927879 | Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures | Jinwoo Choi, Sungjun Chun, Jason L. Frankel, Paul R. Walling | 2015-01-06 |
| 8813000 | System for designing substrates having reference plane voids with strip segments | Sungjun Chun, Anand Haridass | 2014-08-19 |
| 8742565 | Ball grid array with improved single-ended and differential signal performance | Yaping Zhou | 2014-06-03 |
| 8645889 | Noise coupling reduction and impedance discontinuity control in high-speed ceramic modules | Jinwoo Choi, Sungjun Chun, Anand Haridass | 2014-02-04 |
| 8638567 | Circuit manufacturing and design techniques for reference plane voids with strip segment | Sungjun Chun, Anand Haridass | 2014-01-28 |
| 8624297 | Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density | Sungjun Chun, Anand Haridass | 2014-01-07 |
| 8625300 | Circuit manufacturing and design techniques for reference plane voids with strip segment | Sungjun Chun, Anand Haridass | 2014-01-07 |
| 8619432 | Implementing high-speed signaling via dedicated printed circuit-board media | Douglas A. Baska, Daniel M. Dreps, Rohan U. Mandrekar | 2013-12-31 |
| 8593621 | Testing an optical fiber connection | Kevin Bills, Mahesh Bohra, Hong T. Dang, Rohan U. Mandrekar | 2013-11-26 |
| 8572840 | Method of attaching an electronic module power supply | Michael A. Christo, Julio A. Maldonado, Tingdong Zhou | 2013-11-05 |
| 8514583 | System and method for multi-application socket | — | 2013-08-20 |
| 8451020 | System and method for integrated circuit module tamperproof mode personalization | — | 2013-05-28 |
| 8446738 | Motherboard assembly for interconnecting and distributing signals and power | John L. Colbert, Arvind K. Sinha | 2013-05-21 |
| 8399981 | Ball grid array with improved single-ended and differential signal performance | Yaping Zhou | 2013-03-19 |
| 8338948 | Ball grid array with improved single-ended and differential signal performance | Yaping Zhou | 2012-12-25 |