Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9980382 | Method of making a printed circuit board copper plane repair | Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez | 2018-05-22 |
| 9773725 | Coreless multi-layer circuit substrate with minimized pad capacitance | Kevin Bills, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar | 2017-09-26 |
| 9548769 | Reduced wiring requirements with signal slope manipulation | Kevin Bills, Jinwoo Choi, Lloyd A. Walls | 2017-01-17 |
| 9485866 | Printed circuit board copper plane repair | Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez | 2016-11-01 |
| 9374910 | Printed circuit board copper plane repair | Sungjun Chun, Jesus Montanez, Daniel I. Rodriguez | 2016-06-21 |
| 9060428 | Coreless multi-layer circuit substrate with minimized pad capacitance | Kevin Bills, Jinwoo Choi, Tae Tong Kim, Rohan U. Mandrekar | 2015-06-16 |
| 8975525 | Corles multi-layer circuit substrate with minimized pad capacitance | Kevin Bills, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar | 2015-03-10 |
| 8743558 | Reduced wiring requirements with signal slope manipulation | Kevin Bills, Jinwoo Choi, Lloyd A. Walls | 2014-06-03 |
| 8593621 | Testing an optical fiber connection | Kevin Bills, Hong T. Dang, Rohan U. Mandrekar, Roger D. Weekly | 2013-11-26 |
| 8389870 | Coreless multi-layer circuit substrate with minimized pad capacitance | Kevin Bills, Jinwoo Choi, Tae Hong Kim, Rohan U. Mandrekar | 2013-03-05 |
| 8358509 | Reduced wiring requirements with signal slope manipulation | Kevin Bills, Jinwoo Choi, Lloyd A. Walls | 2013-01-22 |