Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12404456 | Standing coke-making furnace and coke-making system | Chenglong Yang, Yang Li, Hanchen Zhao, Ming Cai, Chenguang Jia +7 more | 2025-09-02 |
| D1077892 | Projector | — | 2025-06-03 |
| 12274966 | Filter device having multiple changeable filter surfaces | Madhana Sunder, Allan C. VanDeventer, Jay A. Bunt, Joyce E. Molinelli Acocella, Heather Nicole Polgrean +1 more | 2025-04-15 |
| D1047751 | Heart necklace | — | 2024-10-22 |
| 12052825 | Flexible circuit structure for circuit line bending | Guoda Lian, Shidong Li, Junjun Li, Zhigang Song | 2024-07-30 |
| 12005148 | Coolant-cooled heat sink(s) with associated ultra-violet light assembly | David J. Lewison, Frank L. Pompeo, James A. Busby, Jay A. Bunt, Joyce E. Molinelli Acocella +2 more | 2024-06-11 |
| 11716808 | Tamper-respondent assemblies with porous heat transfer element(s) | Arthur J. Higby, David J. Lewison, Philipp K Buchling Rego, Jay A. Bunt, James A. Busby +1 more | 2023-08-01 |
| 11614324 | Non-destructive bond line thickness measurement of thermal interface material on silicon packages | Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Yu Luo | 2023-03-28 |
| 11430710 | Lid/heat spreader having targeted flexibility | Shidong Li, Jay A. Bunt, Kenneth C. Marston, Hilton T. Toy, David J. Lewison | 2022-08-30 |
| 11191155 | Tamper-respondent assembly with structural material within sealed inner compartment | Jay A. Bunt, Shidong Li, Zhigang Song, Junjun Li, Guoda Lian | 2021-11-30 |
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti | 2021-10-26 |
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz | 2021-10-26 |
| 10842043 | Fabricating coolant-cooled heat sinks with internal thermally-conductive fins | David J. Lewison, Jay A. Bunt, Joyce E. Molinelli Acocella, Jeffrey A. Zitz, Frank L. Pompeo | 2020-11-17 |
| 8541854 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | John M. Cotte, Nils D. Hoivik, Christopher V. Jahnes, Minhua Lu | 2013-09-24 |
| 8163584 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Minhua Lu, Nils D. Hoivik, Christopher V. Jahnes, John M. Cotte | 2012-04-24 |