Marcus E. Interrante — 11 Patents at IBM

Marcus E. Interrante has been granted 11 US patents while listed as an inventor at IBM. The first was granted in 2013 and the most recent in November 2021. Marcus E. Interrante ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Marcus E. Interrante in New Paltz, NY, US.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11164804	Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste	Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard +1 more	2021-11-02	$2,126,000
10978314	Multi integrated circuit chip carrier package	Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz	2021-04-13	$3,936,000
10832987	Managing thermal warpage of a laminate	Charles L. Arvin, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss	2020-11-10	$848,000
10804181	Heterogeneous thermal interface material for corner and or edge degradation mitigation	Sushumna Iruvanti, Shidong Li, Tuhin Sinha	2020-10-13	$4,674,000
10541156	Multi integrated circuit chip carrier package	Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz	2020-01-21	$2,593,000
9583408	Reducing directional stress in an orthotropic encapsulation member of an electronic package	Yi Pan, Hilton T. Toy, Jeffrey A. Zitz	2017-02-28	$2,397,000
9401315	Thermal hot spot cooling for semiconductor devices	Paul F. Bodenweber, Taryn J. Davis, Chenzhou Lian, Kenneth C. Marston, Kathryn C. Rivera +2 more	2016-07-26	$8,130,000
9293439	Electronic module assembly with patterned adhesive array	Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Roger Lam +4 more	2016-03-22	$709,000
9224712	3D bond and assembly process for severely bowed interposer die	Mario J. Interrante, Katsuyuki Sakuma	2015-12-29	$4,224,000
9093563	Electronic module assembly with patterned adhesive array	Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Roger Lam +4 more	2015-07-28	$3,451,000
8444043	Uniform solder reflow fixture	William E. Bernier, Rajneesh Kumar, Chenzhou Lian, Janak G. Patel, Peter Slota, Jr.	2013-05-21	$6,083,000

Marcus E. Interrante — 11 Patents

Issued Patents All Time

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