Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Charles L. Arvin, Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard +1 more | 2021-11-02 |
| 10978314 | Multi integrated circuit chip carrier package | Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2021-04-13 |
| 10832987 | Managing thermal warpage of a laminate | Charles L. Arvin, Thomas E. Lombardi, Hilton T. Toy, Krishna R. Tunga, Thomas Weiss | 2020-11-10 |
| 10804181 | Heterogeneous thermal interface material for corner and or edge degradation mitigation | Sushumna Iruvanti, Shidong Li, Tuhin Sinha | 2020-10-13 |
| 10541156 | Multi integrated circuit chip carrier package | Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy, Jeffrey A. Zitz | 2020-01-21 |
| 9583408 | Reducing directional stress in an orthotropic encapsulation member of an electronic package | Yi Pan, Hilton T. Toy, Jeffrey A. Zitz | 2017-02-28 |
| 9401315 | Thermal hot spot cooling for semiconductor devices | Paul F. Bodenweber, Taryn J. Davis, Chenzhou Lian, Kenneth C. Marston, Kathryn C. Rivera +2 more | 2016-07-26 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Roger Lam +4 more | 2016-03-22 |
| 9224712 | 3D bond and assembly process for severely bowed interposer die | Mario J. Interrante, Katsuyuki Sakuma | 2015-12-29 |
| 9093563 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Roger Lam +4 more | 2015-07-28 |
| 8444043 | Uniform solder reflow fixture | William E. Bernier, Rajneesh Kumar, Chenzhou Lian, Janak G. Patel, Peter Slota, Jr. | 2013-05-21 |