Issued Patents All Time
Showing 25 most recent of 205 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12147074 | Thermo-optic phase shifters | Brian McGowan, Oscar D. Restrepo | 2024-11-19 |
| 12105705 | Database query processing with database clients | Shuo Li, Xiaobo Wang, Sheng Yan Sun | 2024-10-01 |
| 11275720 | Multi-page splitting of a database index | Ying Zhang, Xiaobo Wang, Shuo Li, Leilei Li, Akiko Hoshikawa | 2022-03-15 |
| 11144538 | Predictive database index modification | Shuo Li, Xiaobo Wang, Ping Liang, Min Li, Jeffrey W. Josten | 2021-10-12 |
| 11086836 | Index leaf page splits avoidance or reduction | Xiaobo Wang, Shuo Li, ShengYan Sun, Hong Mei Zhang | 2021-08-10 |
| 10794948 | Electromigration monitor | Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more | 2020-10-06 |
| 10770407 | IC structure with interdigitated conductive elements between metal guard structures | Zhuojie Wu, Cathryn J. Christiansen, Erdem Kaltalioglu, Ronald G. Filippi, Eric D. Hunt-Schroeder +1 more | 2020-09-08 |
| 10677833 | Electromigration monitor | Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more | 2020-06-09 |
| 10388617 | Mechanically anchored C4 pad and method of forming same | Erdem Kaltalioglu, Ronald G. Filippi | 2019-08-20 |
| 10348730 | Reducing complexities of authentication and authorization for enterprise web-based social applications | Yu Guo, Patrick Lin, Joseph Lu, Cindy M. Wu | 2019-07-09 |
| 10325862 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim | 2019-06-18 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Andrew Tae Kim, Chengwen Pei | 2019-05-28 |
| 10297662 | Dielectrically isolated semiconductor device and method for manufacturing the same | Changjun Zhang, Feng Ji, Zuyin Chen | 2019-05-21 |
| 10297546 | Interconnect structures for a security application | Erdem Kaltalioglu, Ronald G. Filippi, Cathryn J. Christiansen | 2019-05-21 |
| 10229875 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more | 2019-03-12 |
| 10205054 | III-nitride nanowire LED with strain modified surface active region and method of making thereof | Linda Romano | 2019-02-12 |
| 10199463 | Nanowire-based vertical memory cell array having a metal layer interposed between a common back plate and the nanowires | Waikin Li, Chengwen Pei | 2019-02-05 |
| 9985615 | On-chip randomness generation | Kai D. Feng, Zhijian Yang, Emmanuel Yashchin | 2018-05-29 |
| 9966431 | Nanowire-based vertical memory cell array having a back plate and nanowire seeds contacting a bit line | Waikin Li, Chengwen Pei | 2018-05-08 |
| 9960226 | High density capacitor structure and method | Wai-Kin Li, Chengwen Pei | 2018-05-01 |
| 9891261 | Electromigration monitor | Fen Chen, Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran +2 more | 2018-02-13 |
| 9882086 | III-nitride nanowire LED with strain modified surface active region and method of making thereof | Linda Romano | 2018-01-30 |
| 9865514 | Inline measurement of through-silicon via depth | Hanyi Ding, J. Edwin Hostetter, Kimball M. Watson | 2018-01-09 |
| 9852999 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Andrew Tae Kim, Chengwen Pei | 2017-12-26 |
| 9817063 | Interconnect reliability structures | Andrew Tae Kim, Ronald G. Filippi | 2017-11-14 |