Issued Patents All Time
Showing 26–50 of 205 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9817063 | Interconnect reliability structures | Andrew Tae Kim, Ronald G. Filippi | 2017-11-14 |
| 9780426 | Phase shifter, accelerator and method of operating the same | Kejun Kang, Jiaru Shi, Chuanxiang Tang, Huaibi Chen, Yaohong Liu +2 more | 2017-10-03 |
| 9772371 | Voltage-driven intelligent characterization bench for semiconductor | Charles J. Montrose | 2017-09-26 |
| 9768110 | Physical unclonable interconnect function array | Kai D. Feng, Wai-Kin Li, Zhijian Yang | 2017-09-19 |
| 9768065 | Interconnect structures with variable dopant levels | Erdem Kaltalioglu, Ronald G. Filippi, Cathryn J. Christiansen | 2017-09-19 |
| 9761539 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim | 2017-09-12 |
| 9755013 | High density capacitor structure and method | Wai-Kin Li, Chengwen Pei | 2017-09-05 |
| 9741657 | TSV deep trench capacitor and anti-fuse structure | Ronald G. Filippi, Erdem Kaltalioglu, Shahab Siddiqui, Lijuan Zhang | 2017-08-22 |
| 9721854 | Structure and method for in-line defect non-contact tests | Hanyi Ding, Kai D. Feng, Zhijian Yang | 2017-08-01 |
| 9702930 | Semiconductor wafer probing system including pressure sensing and control unit | Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Yongchun Xin | 2017-07-11 |
| 9691718 | On-chip semiconductor device having enhanced variability | Wai-Kin Li, Chengwen Pei | 2017-06-27 |
| 9673089 | Interconnect structure with enhanced reliability | Griselda Bonilla, Kaushik Chanda, Robert D. Edwards, Ronald G. Filippi, Andrew H. Simon | 2017-06-06 |
| 9576914 | Inducing device variation for security applications | Wai-Kin Li, Chengwen Pei | 2017-02-21 |
| 9536829 | Programmable electrical fuse in keep out zone | Mukta G. Farooq, Timothy D. Sullivan, Lijuan Zhang | 2017-01-03 |
| 9536779 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Erdem Kaltalioglu, Lijuan Zhang | 2017-01-03 |
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Ronald G. Filippi, Erdem Kaltalioglu, Naftali E. Lustig, Lijuan Zhang | 2016-12-20 |
| 9524930 | Configurable interposer | Oleg Gluschenkov, Yunsheng Song, Tso-Hui Ting | 2016-12-20 |
| 9478509 | Mechanically anchored backside C4 pad | Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim, Lijuan Zhang | 2016-10-25 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-09-13 |
| 9435852 | Integrated circuit (IC) test structure with monitor chain and test wires | Andrew Tae Kim, Cathryn J. Christiansen | 2016-09-06 |
| 9431293 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Erdem Kaltalioglu, Lijuan Zhang | 2016-08-30 |
| 9391030 | On-chip semiconductor device having enhanced variability | Wai-Kin Li, Chengwen Pei | 2016-07-12 |
| 9391014 | Physical unclonable interconnect function array | Kai D. Feng, Wai-Kin Li, Zhijian Yang | 2016-07-12 |
| 9360525 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more | 2016-06-07 |
| 9354252 | Pressure sensing and control for semiconductor wafer probing | Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Yongchun Xin | 2016-05-31 |