Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10644099 | Three-dimensional (3D) metal-insulator-metal capacitor (MIMCAP) and method | Robert Seidel, Thomas Gregory McKay | 2020-05-05 |
| 9559059 | Methods of forming an improved via to contact interface by selective formation of a conductive capping layer | Xunyuan Zhang, Errol Todd Ryan | 2017-01-31 |
| 9466530 | Methods of forming an improved via to contact interface by selective formation of a metal silicide capping layer | Xunyuan Zhang, Errol Todd Ryan | 2016-10-11 |
| 9177858 | Methods for fabricating integrated circuits including barrier layers for interconnect structures | Xunyuan Zhang, Kun Ho Ahn, Bernd Hintze, Frank Koschinsky | 2015-11-03 |
| 9111938 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Chao-Kun Hu, Koichi Motoyama, Chengyu Niu, Andrew H. Simon | 2015-08-18 |
| 9059176 | Copper interconnect with CVD liner and metallic cap | Frieder H. Baumann, Chao-Kun Hu, Andrew H. Simon, Koichi Motoyama, Chengyu Niu | 2015-06-16 |
| 8105942 | CMP-first damascene process scheme | Jihong Choi | 2012-01-31 |
| 7985928 | Gap free anchored conductor and dielectric structure and method for fabrication thereof | Stephan Grunow, David L. Rath, Andrew H. Simon | 2011-07-26 |
| 7671362 | Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing | Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Paul S. McLaughlin, Sujatha Sankaran +3 more | 2010-03-02 |
| 7446036 | Gap free anchored conductor and dielectric structure and method for fabrication thereof | Stephan Grunow, David L. Rath, Andrew H. Simon | 2008-11-04 |
| 7329599 | Method for fabricating a semiconductor device | Frank Wirbeleit, Johannes M. van Meer | 2008-02-12 |