Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2002-02-19 |
| 6287954 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2001-09-11 |
| 6130161 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore, Richard G. Smith | 2000-10-10 |