RS

Richard G. Smith

SE S&C Electric: 13 patents #16 of 210Top 8%
IBM: 9 patents #11,918 of 70,183Top 20%
UC U.S. Controls: 1 patents #7 of 18Top 40%
Overall (All Time): #179,807 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12431701 Dropout recloser Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross 2025-09-30
11916369 Dropout recloser Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross 2024-02-27
11322927 Dropout recloser Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross 2022-05-03
11177103 Fuse link exhaust systems and methods Glenn R. Borchardt 2021-11-16
10818460 Magnetic assembly for generating blow-on contact force Goran Djogo, Daniel Desmond 2020-10-27
10727662 Dropout recloser Yujian Zhou, Jorge Montante, Montengro Alejandro, Michael Ross 2020-07-28
10504678 Remote access pull rig Christopher Lettow 2019-12-10
10099899 Shake-proof hook 2018-10-16
D796941 Shake-proof hook 2017-09-12
D778145 Shake-proof hook 2017-02-07
8824116 Method of determining end-of-life of a fault interrupting device Jason R. Bogusz, Michael G. Ennis, Gary W. Hardesty, Thomas E. Kovanko, Richard P. Mikosz +3 more 2014-09-02
8334738 Fault interrupting and reclosing device Jason R. Bogusz, Michael G. Ennis, Gary W. Hardesty, Thomas E. Kovanko, Richard P. Mikosz +3 more 2012-12-18
7916437 Fault interrupter and operating method Gary W. Hardesty, Michael G. Ennis 2011-03-29
6348731 Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore 2002-02-19
6287954 Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore 2001-09-11
6258710 Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Alexander J. Swinton +1 more 2001-07-10
6130161 Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore 2000-10-10
6069068 Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Alexander J. Swinton +1 more 2000-05-30
6037795 Multiple device test layout Ronald G. Filippi, James J. Poulin, Robert D. Raviart, Kenneth P. Rodbell, Timothy D. Sullivan +1 more 2000-03-14
5760595 High temperature electromigration stress test system, test socket, and use thereof Robert D. Edwards, Du Nguyen, James J. Poulin, Hazara S. Rathore 1998-06-02
5685038 Out-of-balance control for washing machine Kenyon A. Hapke, Spencer C. Schantz 1997-11-11
5563517 Dual channel d.c. low noise measurement system and test methodology Glenn A. Biery, Daniel M. Boyne, Kenneth P. Rodbell, Michael H. Wood 1996-10-08
5434385 Dual channel D.C. low noise measurement system and test methodology Glenn A. Biery, Daniel M. Boyne, Kenneth P. Rodbell, Michael H. Wood 1995-07-18