Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431701 | Dropout recloser | Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross | 2025-09-30 |
| 11916369 | Dropout recloser | Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross | 2024-02-27 |
| 11322927 | Dropout recloser | Yujian Zhou, Jorge Montante, Alejandro Montenegro, Michael Ross | 2022-05-03 |
| 11177103 | Fuse link exhaust systems and methods | Glenn R. Borchardt | 2021-11-16 |
| 10818460 | Magnetic assembly for generating blow-on contact force | Goran Djogo, Daniel Desmond | 2020-10-27 |
| 10727662 | Dropout recloser | Yujian Zhou, Jorge Montante, Montengro Alejandro, Michael Ross | 2020-07-28 |
| 10504678 | Remote access pull rig | Christopher Lettow | 2019-12-10 |
| 10099899 | Shake-proof hook | — | 2018-10-16 |
| D796941 | Shake-proof hook | — | 2017-09-12 |
| D778145 | Shake-proof hook | — | 2017-02-07 |
| 8824116 | Method of determining end-of-life of a fault interrupting device | Jason R. Bogusz, Michael G. Ennis, Gary W. Hardesty, Thomas E. Kovanko, Richard P. Mikosz +3 more | 2014-09-02 |
| 8334738 | Fault interrupting and reclosing device | Jason R. Bogusz, Michael G. Ennis, Gary W. Hardesty, Thomas E. Kovanko, Richard P. Mikosz +3 more | 2012-12-18 |
| 7916437 | Fault interrupter and operating method | Gary W. Hardesty, Michael G. Ennis | 2011-03-29 |
| 6348731 | Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore | 2002-02-19 |
| 6287954 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore | 2001-09-11 |
| 6258710 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Alexander J. Swinton +1 more | 2001-07-10 |
| 6130161 | Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity | Leon Ashley, Hormazdyar M. Dalal, Du Nguyen, Hazara S. Rathore | 2000-10-10 |
| 6069068 | Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity | Hazara S. Rathore, Hormazdyar M. Dalal, Paul S. McLaughlin, Du Nguyen, Alexander J. Swinton +1 more | 2000-05-30 |
| 6037795 | Multiple device test layout | Ronald G. Filippi, James J. Poulin, Robert D. Raviart, Kenneth P. Rodbell, Timothy D. Sullivan +1 more | 2000-03-14 |
| 5760595 | High temperature electromigration stress test system, test socket, and use thereof | Robert D. Edwards, Du Nguyen, James J. Poulin, Hazara S. Rathore | 1998-06-02 |
| 5685038 | Out-of-balance control for washing machine | Kenyon A. Hapke, Spencer C. Schantz | 1997-11-11 |
| 5563517 | Dual channel d.c. low noise measurement system and test methodology | Glenn A. Biery, Daniel M. Boyne, Kenneth P. Rodbell, Michael H. Wood | 1996-10-08 |
| 5434385 | Dual channel D.C. low noise measurement system and test methodology | Glenn A. Biery, Daniel M. Boyne, Kenneth P. Rodbell, Michael H. Wood | 1995-07-18 |